Written by Paul Cuddyer | Director of Sales | Technetics | paul.cuddyer@technetics.com Abstract Technetics Group’s novel thin film coatings provide a fully dense, non-porous, etch resistant uniform coating that can be used to extend the life Read More..
Executive Interview with Ravi Subramanian, SVP & GM of the IC Verification Solutions, Siemens EDA In this interview with Ravi Subramanian, he identifies the latest semiconductor trends, as well as what’s driving those trends, how Read More..
Convergence of Edge Computing, Machine Vision and 5G-Connected Vehicles Manouchehr Rafie, Ph.D., VP of Advanced Technologies, AI Chips & Algorithms, Gyrfalcon Technology Today’s societies are becoming ever more multimedia-centric, data-dependent, and automated. Autonomous systems are Read More..
Paper Submitted by Ted Miracco, CEO, Cylynt COVID-19 has created plenty of global havoc including anti-piracy challenges for professionals working from home. One underreported development is the uptick in software piracy that could range from Read More..
Paper Submitted by Bipul Talukdar, Director of Applications Engineering in North America, SmartDV Â The future of chip design in a few short years could look entirely different as the semiconductor industry witnesses an advancing Read More..
Paper Submitted by Ross Miller, Vice President of Strategic Marketing & Business Unit, SkyWater Technology and Mohamed Kassem, CTO & Co-Founder, Efabless  Wow, 2020 has been a year, hasn’t it? It is going to Read More..
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View PDF here: 2024 GSA Forum Guidelines.
2024 Editorial Calendar
Q1 | Q2 | Q3 | Q4 | |
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Abstract Deadline | January 26 | April 26 | July 26 | October 25 |
Article Deadline | February 23 | May 24 | August 23 | November 22 |
Publication | March 1 | June 3 | September 3 | December 2 |