WISH | Women in Semiconductor Hardware is GSA WLI’s technical conference bringing together industry luminaries, entrepreneurs, and university women in STEM. This event will showcase the changing face of technology and offer new awards celebrating the women who have helped to break the glass ceiling and those who are following in their footsteps. Join our industry in supporting and reaching gender parity.
Breakfast sponsored by
More and more women are joining the semiconductor world, and our industry is taking steps to support and reach for gender parity. As you navigate your own growth path, learn five life-changing lessons from Christine King, one of the pioneering women in semiconductors.
From her humble beginnings as a poor, uneducated, 20-year-old single mom to being the world’s first female CEO of a semiconductor company, Chris has learned essential principles that made her successful. Now, she’s sharing those hard-earned truths with you!
Be inspired by Chris as she shares stories and lessons she’s learned along her path from the trailer park to the boardroom, and get ideas to use in your own life, such as:
• When you have a vision, sell it
• Pace yourself to fit your circumstances
• Don’t sweat the small stuff
• Look for the white space
• The power of the customer and results
• When you can’t go through, go around
Join us for an inspiring and empowering panel discussion, featuring some of the most senior and influential women in the semiconductor industry. These trailblazing leaders have not only risen to the top in a highly competitive field but have also paved the way for future generations. In this session, they will share their personal journeys, keys to success, and insights on how to become effective leaders in the tech world. Attendees will gain valuable advice and practical strategies from these accomplished women who have truly made it to the top in tech. Don’t miss this opportunity to learn from the best and be inspired to achieve your own career aspirations in the semiconductor industry.
Discover the power of allyship in creating an inclusive and supportive semiconductor industry. This panel will feature WLI’s esteemed male allies, nominated by women in the industry. Our panelists will share their experiences, insights, and practical strategies for being effective allies and fostering a culture of support and collaboration. Join us to learn how allyship can drive positive change and create a more inclusive industry for all.
Lunch sponsored by
Explore the transformative impact of artificial intelligence during this panel, featuring leading female experts in the field of AI. This session will delve into how AI is revolutionizing the semiconductor and wider tech industries and its potential to address gender equality. Our distinguished panelists will discuss the latest advancements in AI, its applications, and how it can be leveraged to create more equitable opportunities for women. Join us to gain insights from these pioneering women in AI and understand how this powerful technology can shape a more inclusive future.
Sponsored by
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VIP Reception sponsored by
NVIDIA
Alexis Bjorlin
Vice President & GM, DGX Cloud
NVIDIA
Alexis is vice president and general manager for DGX Cloud at NVIDIA. Prior to NVIDIA, Alexis was vice president for Infrastructure at Meta where her team was responsible for Infrastructure hardware/software co-designed systems, including AI Systems, compute and storage platforms, and custom Silicon. Prior to Meta, she served as senior vice president and general manager of the Broadcom Optical Systems Division and previously Corporate Vice President of the Data Center Group and General Manager of the Connectivity Group at Intel where she oversaw three business units: Ethernet/Networking, High Performance Computing fabrics, and Silicon Photonics. Prior to Intel, she spent eight years as President of Source Photonics, where she also served on the board of directors.
She earned a B.S. in materials science and engineering from the Massachusetts Institute of Technology and a Ph.D. in materials science from the University of California at Santa Barbara.
Alexis Bjorlin
Vice President & GM, DGX Cloud
NVIDIA
Amber Huffman
Principal Engineer, Google Cloud
Amber Huffman is a Principal Engineer in Google Cloud responsible for leading industry engagement efforts in the data center ecosystem across servers, storage, networking, accelerators, power, cooling, security, and more. Before joining Google, she spent 25 years at Intel serving as an Intel Fellow and VP. Amber is the President of NVM Express, on the Board of Directors for the Open Compute Project Foundation (OCP), on the Board of Directors for the Universal Chiplet Express Interconnect, and the chair of the RISC-V Software Ecosystem (RISE) Project. She has led numerous industry standards to successful adoption, including NVM Express, Open NAND Flash Interface, and Serial ATA.
Amber earned a bachelor’s degree in computer engineering from the University of Michigan and a master’s degree in electrical engineering from Stanford University. She has been granted more than 20 patents in storage architecture. Amber is known as an inclusive leader and passionate mentor for technologists, including serving on the Global Semiconductor Alliance Women’s Leadership Council and the University of Michigan’s Computer Science & Engineering National Advisory Board.
Amber Huffman
Principal Engineer, Google Cloud
AMD
Angela Dalton
Director of Strategic Research and Advanced Development Operations
AMD
Dr. Angela Dalton is the Director of Strategic Research and Advanced Development (RAD) Operations at Advanced Micro Devices (AMD). She oversees business operations within the RAD organization and leads a portfolio of strategic initiatives on innovative new hardware and software technologies for high performance computing, artificial intelligence, security, and future computing capabilities. Angela has a B.S. in computer engineering from Virginia Tech as well as an M.S. and a Ph.D. in computer science from Duke University.
Angela Dalton
Director of Strategic Research and Advanced Development Operations
AMD
Rivos
Belli Kuttanna
Co-Founder & CTO
Rivos
Belliappa (Belli) Kuttanna is a co-founder of Rivos Inc. an early-stage startup developing RISC-V based high performance systems targeting Enterprise Server infrastructure.
Prior to founding Rivos in May 2021, Belli was a Senior Fellow and the chief technology officer of Intel Capital at Intel Corporation for 3 years and the Chief Architect of the New Technology Group. He served on Intel’s corporate-level technical leadership pipeline development team for 5 years while mentoring several top technical leaders including women and other diverse individuals across the corporation.
Since the start of his career in 1989, Belli also held positions in the areas of ASIC and processor design and architecture at Texas Instruments Inc., Motorola Inc., Sun Microsystems Inc., and Qualcomm Inc.
Belli holds 30 issued patents and was the recipient of an Intel Achievement Award in 2008.
Belli earned his bachelor’s degree in electronics and communication engineering from Karnataka Regional Engineering College in India and a master’s degree in electrical engineering from Texas A&M University.
Belli Kuttanna
Co-Founder & CTO
Rivos
Henry Schein One
Christine King
CEO & Author of Breaking Through the Silicon Ceiling
Henry Schein One
Christine King serves on the Boards of Directors for Skyworks and Henry Schein One, where she also serves as Executive Chair and CEO. Christine began her career at IBM, where she rose from engineering technologist to leader of IBM’s $6B microelectronics business before her appointment at AMI Semiconductor as the world’s first female CEO of a semiconductor company. A book detailing her life and career, Breaking Through the Silicon Ceiling, was published in 2024.
Christine King
CEO & Author of Breaking Through the Silicon Ceiling
Henry Schein One
Natcast
Deirdre Hanford
Chief Executive Officer & Trustee
Natcast
Deirdre Hanford was appointed Chief Executive Officer and Trustee of Natcast in January 2024. Prior to Natcast, Hanford served as an executive at Synopsys, a technology and market leader in electronic design automation and semiconductor design intellectual property. Over the span of thirty-six years, Hanford’s roles included being Chief Security Officer, Co-General Manager of the Synopsys Design Group, and leader of a variety of customer engagement, applications engineering, sales and marketing groups.
Well known within the semiconductor ecosystem, Hanford has served on many industry advisory boards, including being a leader in the Department of Commerce Industrial Advisory Committee formed through the CHIPS Act.
In July 2024, Hanford was selected to receive the 2025 IEEE Frederik Philips Award “for visionary leadership in electronic design automation for secure and energy-efficient microelectronics.” Hanford was additionally awarded the 2024 Brown Engineering Alumni Medal (BEAM) within the Brown University School of Engineering. She has also been named to WomenTech’s 2022 list of Women in Tech Leaders to Watch, VLSIresearch’s 2017 list of All Stars of the Semiconductor Industry, and National Diversity Council’s 2014 list of Top 50 Most Powerful Women in Technology. In 2001, Hanford was a recipient of the YWCA Tribute to Women and Industry (TWIN) Award and the Marie R. Pistilli Women in EDA Achievement Award.
Hanford earned a B.S. Engineering (electrical engineering) from Brown University and an M.S.E.E. from University of California, Berkeley.
Deirdre Hanford
Chief Executive Officer & Trustee
Natcast
Wolfspeed
Elif Balkas
Chief Technology Officer
Wolfspeed
Elif Balkas serves as the Chief Technology Officer at Wolfspeed, responsible for building on the company’s strong technology foundation in wide bandgap materials, driving technological improvements to yield products with high quality and reliability as Wolfspeed continues to grow as the only pure play, vertically integrated silicon carbide company. During her 19+ tenure with the company, Elif served in a variety of leadership positions in R&D and operations, dedicating most of her time and focus on developing technologies that are scalable for manufacturing purposes and to enable more efficient and powerful electronic systems.
Elif cofounded the Women’s Initiative at Wolfspeed, to encourage, develop and support women who will lead the way in innovation and execution in every aspect of the business and community, and served as the leader of the Professional Development Focus to create an environment where everyone’s perspectives, ideas and contributions matter. She continues to serve on Women’s Initiative’s Steering Committee to foster diversity at all levels to create better results for the Company and our community.
Prior to Wolfspeed, Elif served as a scientist at Intrinsic Semiconductor where she was responsible for GaN and SiC epitaxy product development with a focus on high quality and efficient processes. Elif holds a Ph.D. in Materials Science with a minor in Electrical and Computer Engineering from North Carolina State University, specialized in GaN crystal growth via physical vapor transport. Elif is also graduate of the Chief Technology Officer Program at Wharton School.
Elif Balkas
Chief Technology Officer
Wolfspeed
Hitachi Ventures
Gayathri Radhakrishnan
Partner
Hitachi Ventures
Gayathri (G) Radhakrishnan has over two decades of multi-disciplinary experience across domains such as product management, product marketing, corporate strategy, M&A and venture investments at both Fortune 500 companies and early-stage startups in the technology sector. As a Partner at Hitachi Ventures, she actively invests in technology startups that are enabling digital transformation. Prior to that, she was with Micron Ventures, focused on applied AI in the areas of Manufacturing, Healthcare, Mobility and also enabling technologies in datacenter and storage related technologies.
She has a Masters in EE from The Ohio State University and MBA from INSEAD in France. She is also a Kauffman Fellow.
Gayathri Radhakrishnan
Partner
Hitachi Ventures
Marvell Technology
Jeanne Trinko Mechler
Fellow, Custom & Compute Silicon
Marvell Technology
Jeanne Trinko Mechler is a fellow at Marvell Technology in Custom & Compute Silicon, with over 30 years of experience in SOC design, including AI/ML accelerators. After 30 years at IBM, she joined GLOBALFOUNDRIES in 2015 and Marvell in 2018, where she has led over 60 chip designs across 10+ technology nodes.
She is the author of High Speed SerDes Devices and Applications and holds more than 20 patents/publications. Jeanne chairs Marvell’s engineering conference and has been an invited speaker at the Design Automation Conference. She holds the M.S. and B.S. in electrical engineering from the University of Vermont and the M.S. degree in engineering management from the National Technological University.
Jeanne Trinko Mechler
Fellow, Custom & Compute Silicon
Marvell Technology
Seagate
Lalitha Suryanarayana
Vice President, Corporate Development and Strategy
Seagate
Lalitha Suryanarayana joined Seagate in 2022 as Vice President of Corporate Development and Strategy. In this role, she leads the company’s strategic initiatives relating to mergers, acquisitions and divestitures, equity investments and emerging growth opportunities. Lalitha’s thirty-year career spans a diverse set of leadership roles in corporate strategy, product management, ecosystem partnerships and R&D within the semiconductor and telecom industries. Prior to Seagate, she served as VP of Strategy and M&A for Infineon Technologies, Americas.
Ms. Suryanarayana is the inventor on fifty issued patents and has multiple publications including a technical book to her credit. During her early tenure as an R&D engineer, she was widely recognized for her pioneering contributions to the industry standardization of mobile and device-independent web technologies.
Lalitha holds an M.S. degree in Electrical Engineering from New York University and an M.B.A. from the University of Texas, Austin.
Lalitha Suryanarayana
Vice President, Corporate Development and Strategy
Seagate
Intel
Lama Nachman
Senior Fellow, Director of Intelligent Systems Lab
Intel
Lama Nachman is an Intel fellow and serves as the Director of Intelligent Systems Research Lab within Intel Labs. With a profound commitment to advancing human potential through AI, her research centers on Responsible Human AI Collaboration. Leading a diverse and multi-disciplinary team of researchers, Lama delves into innovative user experiences, sensing systems, algorithms, and applications, with a focus on transferring these advancements to Intel’s business units to shape the future of their products and influence manufacturing and design with AI. With 28 years of expertise spanning context-aware computing, human/AI systems, responsible AI, multi-modal interactions, sensor networks, computer architecture, embedded systems, and wireless technologies, Lama also spearheads Intel’s Responsible AI program and the RAI Advisory Council.
In addition to her research, Lama has made significant contributions to the academic community. She has served as an editor for prestigious publications such as IMWUT (Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies) and TIOT (IEEE Transactions on Internet of Things) as well as many other top tier Technical Program Committees over the years. Furthermore, Lama actively participates in cross-industry programs and partnerships bridging the gap between academia and industry to drive innovation and societal impact.
One of her most notable accomplishments was her collaboration with the renowned Professor Stephen Hawking. Commencing in 2012, Lama led a dedicated team in developing a groundbreaking software platform and sensing system that facilitated Hawking’s communication. She further championed the open-source release of this technology, empowering individuals with disabilities worldwide to communicate effectively and live with increased independence. With a passion for technology and a dedication to responsible AI, Lama continues to shape the landscape of AI research, ensuring that its benefits are accessible to all. Lama’s academic background includes a BS and MS in computer engineering from the University of Wisconsin-Madison, and she has over 80 publications across her diverse research interests.
Lama Nachman
Senior Fellow, Director of Intelligent Systems Lab
Intel
Synopsys
Nuno Ramalho
Executive Director, R&D
Synopsys
Nuno Ramalho is an Executive Director of R&D at Synopsys responsible for Worldwide CAD in Solutions Group and Site Leader for Synopsys in Lisbon. Prior to joining Synopsys in 2009, he was VP at Chipidea Microelectronica and Director of R&D. Before joining Chipidea, Nuno worked 13 years as a research engineer and design manager at Philips Research and Philips Semiconductors in The Netherlands, UK, France, and at IMEC in Belgium, specializing in Analog and Mixed-Signal IC design for Audio, Video, Magnetic Recording and Optical Communications.
Nuno received his BAI and MSc degrees in Microelectronics in 1988 from Trinity College, University of Dublin. He has put numerous ICs into production, co-authored 6 papers, and holds 14 US and European patents. Inclusion & Diversity initiatives are part of his identity, born in the Azores but lived from an early age in 8 countries across 3 continents, has dual citizenship and speaks four languages.
Nuno Ramalho
Executive Director, R&D
Synopsys
Parthasarathy (Partha) Ranganathan
Vice President & Technical Fellow
Parthasarathy (Partha) Ranganathan is currently a VP, technical Fellow at Google where he is the area technical lead for hardware and datacenters, designing systems at scale. Prior to this, he was a HP Fellow and Chief Technologist at Hewlett Packard Labs where he led their research on systems and data centers. Partha has worked on several interdisciplinary systems projects with broad impact on both academia and industry, including widely-used innovations in energy-aware user interfaces, heterogeneous multi-cores, power-efficient servers, accelerators, and disaggregated and data-centric data centers. He has published extensively (including being the co-author on the popular “Datacenter as a Computer” textbook), is a co-inventor on more than 100 patents, and has been recognized with numerous awards. He has been named a top-15 enterprise technology rock star by Business Insider, one of the top 35 young innovators in the world by MIT Tech Review, and is a recipient of the ACM SIGARCH Maurice Wilkes award, Rice University’s Outstanding Young Engineering Alumni award, and the IIT Madras distinguished alumni award. He is one of few computer scientists to have his work recognized with an Emmy award. He is also a Fellow of the IEEE and ACM, and has also served on the board of directors for OpenCompute.
Parthasarathy (Partha) Ranganathan
Vice President & Technical Fellow
Microsoft
Rani Borkar
Corporate Vice President, Azure Hardware Systems and Infrastructure
Microsoft
Rani Borkar has served as Corporate Vice President, Azure Hardware Systems and Infrastructure, at Microsoft Corporation, a global technology provider, since June 2019. She also served as Microsoft’s Corporate Vice President, Microsoft Cloud Capacity, Supply Chain and Provisioning, from 2017 to June 2019. From 2016 to 2017, Ms. Borkar was Vice President, OpenPOWER Development at IBM Corporation, a global technology and consulting company. Prior to IBM, Ms. Borkar worked at Intel Corporation for 27 years, most recently as Intel’s Corporate Vice President and General Manager, Product Development Group.
Ms. Borkar serves as a member of the board of directors of the Global Semiconductor Alliance (GSA).
Ms. Borkar joined the Applied Materials board of directors in 2020.
Rani Borkar
Corporate Vice President, Azure Hardware Systems and Infrastructure
Microsoft
Qualcomm
Rajeev Pal
Vice President, Engineering
Qualcomm
An accomplished leader with over two decades of experience in Software Project and Global Team leadership. Proven track record of successful leadership in industry-leading products such as 5G Modem/chipset, 2 Gbps LTE/Snapdragon X24, 5G Multimode/NAS, Snapdragon 810, Snapdragon X5 LTE Modem, and BREW. Demonstrated ability to translate visions into missions, and deliverables and delighting the stakeholders with exceptional execution. Effective leader with the capacity to build, mentor, and manage high-performing global teams including onsite and offshore employees. Excellent technology background including experience in large-scale software development, integration, and process deployments including the market launch of multiple chipset and handset products. Extensive international experience includes managing various programs and directing multi-site operations. Proficiency in engineering as well as business management.
Rajeev Pal
Vice President, Engineering
Qualcomm
Qualcomm & Credo Technologies
Sylvia Acevedo
Board Member
Qualcomm & Credo Technologies
Sylvia Acevedo is an eminent leader who has made an enduring impact across diverse industries, excelling in both corporate and public sectors as a pioneering trailblazer. Beginning her career as a rocket scientist at NASA’s Jet Propulsion Laboratory, Sylvia’s journey took her through executive roles at renowned companies such as Apple, Autodesk, Dell, and IBM. Sylvia currently serves on the Public company Corporate Board of Directors of Qualcomm and Credo Technologies.
From 2016 to 2020, she was the CEO of the Girl Scouts of the USA, modernizing the organization with over 126 new STEM badge programs. Sylvia also served as a White House Commissioner during the Obama Administration.
Sylvia authored the bestselling memoir, ‘Path to the Stars: My Journey from Girl Scout to Rocket Scientist,’ promoting perseverance and self-determination.
Sylvia holds a Bachelor’s degree with Honors in Industrial Engineering from New Mexico State University and a Master’s engineering graduate degree from Stanford University, where she was one of the first Hispanics, male or female, to earn such a degree. Sylvia was awarded an Honorary Doctorate from Washington College, and in 2022, Duke University awarded her an Honorary Doctorate of Science.
Sylvia Acevedo
Board Member
Qualcomm & Credo Technologies
STMicroelectronics
(Design) Aradhana Kumari
Technical Leader
STMicroelectronics
Aradhana is working as a Staff Engineer in the Strategy, Innovation and R&D governance at STMicroelectronics Crolles, France. She is a digital designer primarily responsible for the design of high-speed link controllers. She is skilled in digital logic synthesis, place-route, & timing flows for high-speed and low-power designs that mandate high figure of merit. She has 4 US patent filings and 8 publications in major international conferences. Aradhana is the winner of 2023 GSA Female Up & Comer award. She was awarded the Special Achievement Award this year by the Global MIPI Alliance for her contributions to I3C proliferation.
Aradhana completed her Masters in Engineering from the Indian Institute of Technology and has over 4.5 years experience in the semiconductor industry.
(Design) Aradhana Kumari
Technical Leader
STMicroelectronics
Amazon Web Services
(Design) Dhara Vaishnav
Leader, Solutions Architecture Hi-Tech Electronics Semiconductors
Amazon Web Services
Dhara is Leader, Solution Architecture, HiTech Electronics Semiconductor at AWS. Her team caters to enterprise customers in three sub-verticals: Integrated Design Manufacturing, Electronic Manufacturing Services, and Equipment Suppliers. She is passionate about helping customers with their digital transformation journey in areas such as smart manufacturing, semiconductor EDA, Generative AI, Artificial Intelligence & Machine Learning, and Data Engineering/Science.
She joined Amazon in 2016 and has held several engineering/tech roles in data engineering, data science, and solution architecture. Her mission is to build high-impact teams by embracing the collective experiences and diverse perspective of individuals, recognizing the markets with the greatest needs, and innovating and building world-class solutions for customers.
Prior to Amazon, she was a technical leader at Intel, HP, and Cognizant. She has a Bachelor Of Engineering (Computer Science) degree from Gujarat, India and holds an MBA from UC Berkeley, Haas School Of Business.
(Design) Dhara Vaishnav
Leader, Solutions Architecture Hi-Tech Electronics Semiconductors
Amazon Web Services
Microsoft
(Design) Faye Yang
Senior Hardware Systems Engineer, Cloud AI / Advanced System Group
Microsoft
Faye Yang is a Senior Hardware Systems Engineer in the Cloud AI and Advanced System Group at Microsoft Corporation, based in Mountain View. With more than 10 years of experience developing hardware system architecture, Faye has been pivotal in designing and integrating next generation network accelerator cards. Her contributions have driven innovation and excellence in the hardware systems.
Before joining Microsoft, Faye was a hardware engineer at Amazon Web Services, where she led the design of high- speed networking switch products. Prior to AWS, she worked as a hardware developer at Cisco Systems. Faye holds a master’s degree in electrical engineering from the University of Southern California.
(Design) Faye Yang
Senior Hardware Systems Engineer, Cloud AI / Advanced System Group
Microsoft
Meta
(AI) Granthana Rangaswamy
Senior Hardware Systems Engineer
Meta
Granthana is a Senior Hardware Systems Engineer for Meta’s Next-Generation Training and Inference Accelerator Systems. With over 20 years of experience, she possesses extensive technical and leadership expertise in a wide range of networking and compute products. Throughout her career, Granthana has worked at multiple companies, including Intel, Juniper Networks, and Meta, leading complex and diverse systems that span from remote radio units to intricate MTIA systems designed for Meta’s AI workloads. She holds four patents, Masters Degree is Electrical Engineering and has authored multiple publications. Currently, she is exploring the application of machine learning techniques to analyze high-speed hardware systems.
(AI) Granthana Rangaswamy
Senior Hardware Systems Engineer
Meta
Synaptics
(Test) Kate Cheng
Senior Staff Test Development Engineer
Synaptics
Kate is a Senior Staff Test Development Engineer for Wireless Products Division in Synaptics. She works for test solution development, yield improvement, and customer failure analysis for RF products, mainly WiFi and BT combo chips. She is familiar with different tester platforms including Teradyne Ultraflex, J750 and Eagle Test System.
Prior to Synaptics, she worked in Texas Instruments Taiwan as product engineer and test development engineer responsible for high speed data converter and automotive LDO and LED drivers. Kate received B.S. and M.S. in engineering and system science from National Tsing Hua University in 2007 and 2009.
(Test) Kate Cheng
Senior Staff Test Development Engineer
Synaptics
AMD
(Test) Khushboo Agarwal
Principal Member Of Technical Staff/DFT Manager
AMD
Khushboo has 18+ years of experience in the semiconductor industry. She started her career with Texas Instruments, and after spending 8 years at TI, joined AMD in 2014.
Khushboo’s primary focus has been on overall test architecture, test clocking, coverage and low-power DFT. At TI, she worked on SOC DFT RTL development, ATPG as well as post-silicon support. After joining AMD (Circuit Technology DFT team) she has been working on DFT architecture as well as DFT sub-system RTL development for several generations of PHYs (both third-party as well as in-house).
Apart from work, she likes spending quality time with my family and cooking in her free time.
(Test) Khushboo Agarwal
Principal Member Of Technical Staff/DFT Manager
AMD
Micron Technology
(Process) Lakshmi Suresh
Senior Engineer Lead, Metals
Micron Technology
Lakshmi Suresh is a Senior Engineer Lead – Metals at Micron, specializing in advanced metallization processes for wordline (WL) and interconnect technologies in next-generation semiconductor devices. Since joining Micron in December 2021, she has worked across Boise and Singapore sites, focusing on innovative solutions for improving material performance, playing a pivotal role in developing scalable, high-reliability processes for critical applications.
Lakshmi earned her PhD in Materials Science and Engineering from the National University of Singapore in 2021, where she researched photo-electrochemical materials for energy storage and sensing. Her work, widely published in top-tier journals, continues to drive progress in the semiconductor industry.
(Process) Lakshmi Suresh
Senior Engineer Lead, Metals
Micron Technology
Teradyne
(Test) Lauren Getz
Product & Segment Manager
Teradyne
Lauren Getz is the mobile power segment product manager at Teradyne, where she has been integral to developing the next generation of test technology and software tools for power and precision analog devices. Prior to this, she was a factory applications engineer supporting product upgrades and applications development globally. Lauren was a SEMI 20 under 30 recipient, which recognizes the industry’s brightest young leaders, and holds a Bachelor of Science degree in electrical and computer engineering.
(Test) Lauren Getz
Product & Segment Manager
Teradyne
Synopsys
(Test) Lei Han
Test & Validation Engineer
Synopsys
Lei Han is a staff Test & Validation engineer within Synopsys’ design technology group. Since 2020, Lei has concentrated on optimizing the backend flow to guarantee the robustness of EDA and clock quality through comprehensive testing. With a fervor for pioneering solutions, Lei seeks to establish the testing framework and explore validation methodologies. The emphasis on clock sensitivity testing exemplifies a proactive approach to addressing customer requirements and left-shifting the development cycle.
In 2023, Lei Han was recognized with the Technical Leadership Award. Lei earned a BS degree from the Joint Institute of Shanghai Jiaotong University and the University of Michigan in 2020.
(Test) Lei Han
Test & Validation Engineer
Synopsys
Marvell Technology
(AI) Patricia Fong
Senior Staff Manager
Marvell Technology
Patricia Fong is a Senior Staff Manager with Marvell in Santa Clara Custom Compute & Storage and has been focused on Back-End Design for the past 16 years. Over this time, Patricia has helped taped out over 25 designs from 90nm to 5nm process nodes. Patricia holds a Master of Engineering in Engineering Management from Duke University and a Bachelors of Science in Electrical Engineering and Computer Science from University of California, Berkeley.
(AI) Patricia Fong
Senior Staff Manager
Marvell Technology
Marvell Technology
(Test) Rachana Maitra
Senior Principal Engineer, Corporate SDL
Marvell Technology
Rachana Maitra is a Senior Principal Engineer and Corporate SDL lead at Marvell Technology Inc.
She has worked in the tech industry for over 25 years, which started in 1999 at Intel corporation as a verification/validation engineer. In 2006, she joined Marvell and went on to leading pre- and post-silicon validation efforts for 16 years covering 20+ products, across multiple business units. In 2022, Rachana joined central management team and took on the responsibility of leading Marvell’s proactive process and strategy for product security assurance.
Rachana earned MSE in Electrical Engineering from Arizona State University. She regularly volunteers at hospice of the valley and enjoys spending time with family in her spare time.
(Test) Rachana Maitra
Senior Principal Engineer, Corporate SDL
Marvell Technology
Meta
(Test) Salina Dbritto
AI/HPC Systems Engineer
Meta
Salina is an AI/HPC systems engineer at Meta, where she specializes in developing interconnect solutions, automation strategies, and test and validation flows for AI systems. She provides technical leadership in integrating networking flows with compute and silicon to land AI systems. She leads the System Integration forum at Meta, which focuses on building integrated automation, tooling stack, and test strategies for AI, driving the shift from component to system mindset.
Salina has over 10 years of industry experience. Before joining Meta, she worked as a Network Development Engineer at Dell. She holds a master’s degree in electrical engineering with majors in Networking from San Jose State University. Passionate about public speaking, singing and event management.
(Test) Salina Dbritto
AI/HPC Systems Engineer
Meta
Siemens EDA
(AI) Srividya Jayaram
Principal Product Engineering Manager, Fab Analytics
Siemens EDA
Srividya Jayaram is the Principal Product Engineering Manager for the Wafer Defect Management solutions and Fab Insights products under Calibre semiconductor manufacturing software tools at Siemens EDA. She currently leads the product engineering and marketing efforts for Fab analytics domain, researching practical EDA solutions to challenges identified in the Fab. She joined Mentor Graphics in 2005 (acquired by Siemens in 2017) and held various product engineering and technical marketing roles in OPC and RET areas.
Sri has over 35 publications and is actively involved in the SPIE and SEMI activities. She received her B.S. degree in Electronics Engineering from University of Madras, India and Masters in Electrical Engineering from State University of New York at Buffalo.
(AI) Srividya Jayaram
Principal Product Engineering Manager, Fab Analytics
Siemens EDA
Amazon Web Services
(Process) Upasana Pandya
Senior Customer Solutions Manager
Amazon Web Services
Upasana is a Sr. Customer Solutions Manager supporting enterprise customers. She has worked in the tech industry for over 18 years in serving various leadership roles across Utility, Education, Pharma and most recently at AWS. In her last 2.5 years at AWS she has led many transformation projects focusing on Datalake modernizations and GenAI.
Prior to joining AWS, she served as an advisor to the CIO for PSEG (Public Service Enterprise Group), a leading utility company. Prior to that, She held technology leadership roles in consulting with 10 years in driving large-scale programs and projects for internal capability development and external clients across Pharma, Education, Transportation and Construction industries.
(Process) Upasana Pandya
Senior Customer Solutions Manager
Amazon Web Services
Micron Technology
(Process) Yashvi Singh
Process Integration Engineer, R&D DRAM
Micron Technology
Yashvi Singh has been a Process Integration Engineer with the R&D DRAM Organization at Micron Technology since September 2019. She has worked at various Micron locations, such as Boise USA, Taichung Taiwan and Hiroshima Japan. She leads multiple module development projects for next-generation DRAM nodes.
Ms. Singh earned her master’s degree (2019) in Materials Science and Engineering from Stanford University, USA. She holds a Bachelor of Technology degree (2017) in Metallurgical and Materials Engineering from NIT Trichy, India, where she graduated as the Valedictorian and received the President Medal. Ms. Singh is an alumna of the Boise Metro Chamber’s Leadership program (2021-2023). She is passionate about human rights issues and enjoys painting, traveling, reading, and skiing.
(Process) Yashvi Singh
Process Integration Engineer, R&D DRAM
Micron Technology
Rising Women in Semi Award Sponsor
Western Digital has long been at the forefront of game changing innovations. From the invention of the first hard drive to recent advancements in 3D NAND our journey of innovation continues to inspire those who dare to think big.
Title Sponsor
Marvell is trusted by the world’s leading technology companies for 25 years, we move, store, process and secure the world’s data with semiconductor solutions designed for our customers’ current needs and future ambitions. Through a process of deep collaboration and transparency, we’re ultimately changing the way tomorrow’s enterprise, cloud, automotive, and carrier architectures transform—for the better.
Female Up and Comer Award Sponsor
AMD is the high performance and adaptive computing leader, powering the products and services that help solve the world’s most important challenges. Our technologies advance the future of the data center, embedded, gaming and PC markets.
Founded in 1969 as a Silicon Valley start-up, the AMD journey began with dozens of employees who were passionate about creating leading-edge semiconductor products. AMD has grown into a global company setting the standard for modern computing, with many important industry firsts and major technological achievements along the way.
VIP Dinner Sponsor
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Designing the Difference Award Sponsor
Microsoft enables digital transformation for the era of an intelligent cloud and an intelligent edge. Its mission is to empower every person and every organization on the planet to achieve more. Microsoft Azure is the world’s most advanced computing platform that enables organizations to solve complex problems and drive human ingenuity. Behind Azure’s ever-expanding suite of cloud offerings is a set of scalable, secure, and sustainable hardware systems and infrastructure. With datacenters in over 60 regions across the globe and availability in 140 countries, Azure is trusted & resilient and responsibly designed to enable innovation from the edge to the cloud.
Wellness Break Sponsor
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors that power the world. We innovate with customers to deliver efficient, high-performance products for automotive, IoT, and communications markets. With a global footprint across the U.S., Europe, and Asia, GF is a trusted source for customers. Our diverse team is committed to security, sustainability, and a vibrant DEIB program, aiming to set the standard for women in the semiconductor industry. We ensure equal opportunities and prioritize employee wellbeing. For more information, visit www.gf.com.
Breakfast Sponsor
Siemens AG is an engineering and manufacturing company focusing on electrification, automation, and digitalization. Siemens also provides engineering solutions in automation and control, power, transportation, and medical diagnosis. Siemens EDA is a broad line supplier of EDA tools serving wide variety of markets ranging from communications, consumer electronics, semiconductors, networking, multimedia, military and aerospace, and transportation. It provides a complete semiconductor design flow that includes simulation, emulation, place and route, verification, design for manufacturing, and test, as well as developing tools for wire harness systems and computational fluid dynamics.
VIP Reception Sponsor
TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2023, TSMC served 528 customers and manufactured 11,895 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 16 million 12-inch equivalent wafers in 2023.
Lunch Sponsor
Samsung Semiconductor is a world-leading semiconductor manufacturer with a wide range of products that power the tools you use every day – including smartphones, electric vehicles, hyperscale data centers, IoT devices, and more. With a strong focus on innovation, Samsung designs and manufactures memory, system LSI, foundry, and LED solutions. Set to open in 2024, Samsung recently broke ground on a state-of-the-art Foundry in Taylor, Texas that will power next-generation technologies in areas like 5G, artificial intelligence (AI), and high-performance computing (HPC).
Lanyard Sponsor
ASE, Inc. is the leading global provider of semiconductor manufacturing services in packaging and test. With strong leadership in heterogeneous integration, manufacturing efficiency, and sustainability approaches, packaging innovation is at the heart of what ASE does. Today, ASE’s advanced packaging, system-in-package, and chiplet solutions are accelerating growth momentum across AI, HPC, Data Center, Automotive, IoT, 5G, and more. To learn about our technology advances and our VIPack™ and powerSiP™ platforms, please visit aseglobal.com or follow us on LinkedIn and X: @aseglobal.
Photo Booth Sponsor
Credo’s mission is to deliver high-speed solutions that break bandwidth barriers on every wired connection in the data infrastructure market. We provide innovative, secure, high-speed connectivity solutions that deliver improved power and cost efficiency as data rates and corresponding bandwidth requirements increase exponentially throughout the data infrastructure market.
Wi-Fi Sponsor
Synopsys delivers the most trusted and comprehensive silicon to systems design solutions, accelerating technology innovation. We partner closely with our customers to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Companies trust Synopsys to pioneer new technologies to help them get to market faster without compromise.
Charging Station Sponsor
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Platinum Sponsor
TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2023, TSMC served 528 customers and manufactured 11,895 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 16 million 12-inch equivalent wafers in 2023.
Platinum Sponsor
Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology.
Platinum Sponsor
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
Platinum Sponsor
Microsoft enables digital transformation for the era of an intelligent cloud and an intelligent edge. Its mission is to empower every person and every organization on the planet to achieve more. Microsoft Azure is the world’s most advanced computing platform that enables organizations to solve complex problems and drive human ingenuity. Behind Azure’s ever-expanding suite of cloud offerings is a set of scalable, secure, and sustainable hardware systems and infrastructure. With datacenters in over 60 regions across the globe and availability in 140 countries, Azure is trusted & resilient and responsibly designed to enable innovation from the edge to the cloud.
Platinum Sponsor
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 45 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
Platinum Sponsor
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
General Sponsor
#WeAreCisco, where every individual brings their unique skills and perspectives together to pursue our purpose of powering an inclusive future for all.
Our passion is connection—we celebrate our employees’ diverse set of backgrounds and focus on unlocking potential. Cisconians often experience one company, many careers where learning and development are encouraged and supported at every stage. Our technology, tools, and culture pioneered hybrid work trends, allowing all to not only give their best, but be their best.
We understand our outstanding opportunity to bring communities together and at the heart of that is our people. One-third of Cisconians collaborate in our 30 employee resource organizations, called Inclusive Communities, to connect, foster belonging, learn to be informed allies, and make a difference. Dedicated paid time off to volunteer—80 hours each year—allows us to give back to causes we are passionate about, and nearly 86% do!
Our purpose, driven by our people, is what makes us the worldwide leader in technology that powers the internet.
Helping our customers reimagine their applications, secure their enterprise, transform their infrastructure, and meet their sustainability goals is what we do best. We ensure that every step we take is a step towards a more inclusive future for all. Take your next step and be you, with us!
General Sponsor
Qorvo products are at work connecting, protecting and powering the planet. We bring core radio frequency (RF) and power technologies and solutions to mobile, infrastructure, the IoT, defense/aerospace and power management markets. Transforming the way you live, work, play and communicate — that’s what inspires us.
General Sponsor
Millions of people experience Synaptics technology every day. Whether in your hand, pocket or purse, on your desk, in your home or in your car, our technology is likely inches from you right now. Our solutions impact how users interact with technology in numerous ways; what they see, what they hear, how they touch, how they engage, and how they connect.
Gold Sponsor
Alphawave Semi is a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure. Faced with the exponential growth of data, Alphawave Semi’s technology services a critical need: enabling data to travel faster, more reliably, and with higher performance at lower power. We are a vertically integrated semiconductor company, and our IP, custom silicon, and connectivity products are deployed by global tier-one customers in data centres, compute, networking, AI, 5G, autonomous vehicles, and storage. Founded in 2017 by an expert technical team with a proven track record in licensing semiconductor IP, our mission is to accelerate the critical data infrastructure at the heart of our digital world.
Gold Sponsor
Semiconductors are crucial to solve the energy challenges of our time and shape digital transformation. This is why Infineon is committed to actively driving decarbonization and digitalization. As a global semiconductor leader in power systems and IoT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We make life easier, safer, and greener.
Gold Sponsor
Teradyne tests and helps build the world’s most innovative products. Our leading-edge testers make sure that new products work right the first time, every time. And our robotics portfolio helps manufacturers to develop and deliver new products quickly, efficiently and cost-effectively. From idea to final product – we test and automate it all.
Standard pricing is valid through October 14, 2024.
Late pricing begins October 15, 2024.
WISH is free for university students. University students, please reach out to events@gsaglobal.org for your complimentary attendee code.
150 W San Carlos St
San Jose, CA 95113 United States
Join us at the San Jose McEnery Convention Center, a premier destination in the heart of Silicon Valley, for an unforgettable event. This state-of-the-art venue is an ideal location for networking with industry leaders and innovators, right here in Silicon Valley. With its expansive, flexible spaces and cutting-edge facilities, the convention center promises a conducive environment for exchange of ideas and growth. Don’t miss the chance to connect with peers, explore new trends, and experience the pulse of technology at one of the most celebrated venues in the tech world.
As part of our commitment to making your stay as seamless as possible, we have arranged hotel rooms at the Hilton San Jose. Please contact events@gsaglobal.org to secure your stay.
WISH is free for university students. University students, please reach out to events@gsaglobal.org for your complimentary attendee code.