The GSA International Summit invites senior executives from the global semiconductor ecosystem for an exclusive conference to explore the pivotal role of semiconductors, which serve as the foundation of modern technology. Semiconductors have become the focal point of global economies and are central to innovation, technology, and human ingenuity. As the industry navigates unprecedented challenges and opportunities, this conference aims to strike a balance between resilience and innovation.
The GSA International Summit convenes 100+ top executives from the expanded semiconductor ecosystem for discussions and collaboration on pressing business and technology issues surrounding the industry.
The semiconductor industry is experiencing unprecedented growth as new opportunities beyond traditional markets continue to emerge. With the evolution of automotive technology, the exponential rise of generative AI applications, and the demand for high-bandwidth memory solutions for high-performance computing, the industry’s potential continues to expand.
This year’s theme, “Core to Semiconductor Infinity,” will delve into technological advancements that are enabling growth markets and driving the industry’s future. The Summit provides a unique opportunity for senior executives to engage in candid discussions and share insights that will significantly impact the future of the semiconductor industry.
Jodi Shelton / CEO / GSA
Qiwei Ren / CEO / UNISOC & GSA BOD Member
UNISOC
Dr. Qiwei Ren
CEO
UNISOC
Dr. Qiwei Ren received the bachelor and master degrees from Tsinghua University in 1992 and 1995 respectively, and Ph. D. from Delft University of Technology in 2002.
In 2001, he joined Philips Semiconductors in the Netherlands, worked for embedded memory development as senior designer and project leader.
In 2006, he joined the design center of Qimonda Technology in Xi’an, China, as the Design Director for DRAM product development. In 2009 he promoted the acquisition as co-founder and re-found the design center as Xi’an Sinochip Semiconductors Co. Ltd, worked as general manager. In 2015 the company was acquired again and renamed as Xi’an UniIC Semiconductors Co. Ltd. In 2018 he started to work as CEO of UNIC memory technology Co. Ltd in the same time. From 2022, he becomes the CEO of UNISOC (Shanghai) Technologies Co., Ltd..
In 2012-2017 he was part time professor in Xi’an Jiaotong University, and IEEE senior member for many years.
Dr. Qiwei Ren
CEO
UNISOC
VeriSilicon
Wayne Dai
Chairman, President and CEO
VeriSilicon
Dr. Wayne Dai founded VeriSilicon in August 2001 and has served as the chairman of the board of directors, President and Chief Executive Officer since then. Prior to founding VeriSilicon, Dr. Dai was the Co-Chairman and Chief Technology Officer of Celestry Technologies, Inc., an EDA company, which was acquired by Cadence Design Systems in 2002. Prior to that, he was the founder, chairman of the board of directors, and Chief Executive Officer of Ultima Interconnect Technology, Inc., one of the predecessor companies to Celestry.
Dr. Dai was the founding Chairman of the IEEE Multi-Chip Module Conference and IEEE Symposium on IC/Package Design Integration, Co-Chairman of the Program Committee of the 2010 International Green Energy Forum. He was an Associate Editor of IEEE Transactions on Circuits and Systems and an Associate Editor of IEEE Transactions on VLSI Systems. He has published more than 100 papers in technical journals and conferences and received the NSF Presidential Young Investigator Award from the President of United States in 1990. He was recognized as top ten venture-backed entrepreneurs and top ten talents of science and technology in China in 2005. He was honored with The Ernst & Young Entrepreneur of the Year in China in 2007. He won the ACE’s Executive of the Year award in 2013, the Hurun Industry Achievement Award in 2014, the APAC Innovator of the year of WEAA in 2018, and was recognized as a “Leading Pioneer” in 2018 by Shanghai Smart City Construction, 2019 Contributor of the year and 2021 Outstanding Contributor of Industry Progress of WEAA, the 2021 Sci-Tech Innovation Golden Horse Awards Outstanding Leader award, 2023 Annual Outstanding Person of China IC Industry, and High Tech Contributor of the Year of 2023 Compass Tech Award. He is currently the Vice Chairman of Global Innovation Center, the Executive Vice President of the International Union for Science and Technology Innovation, the Vice President of the China Semiconductor Industry Association IC Design Branch, the President of the China RISC-V Industry Consortium, the Vice President and the Expert Committee Member of the Automotive Electronics Industry Alliance, the President of the Shanghai Open Processor Innovation Center, the Vice President of Shanghai Integrated Circuit Industry Association, the Vice Chairman of the Expert Committee of the Shanghai IC Industry Cluster Development Promotion Institution, and the President of Berkeley Club of Shanghai.
Dr. Dai received his B.A. degree in Computer Science and his Ph.D. degree in Electrical Engineering from the University of California at Berkeley. He was a professor in the department of Computer Engineering at the University of California at Santa Cruz.
Wayne Dai
Chairman, President and CEO
VeriSilicon
GSME
Farhat Jahamgir
Founder, President and CEO
GSME
Farhat is the founder and CEO of GSME, where he brings over 25 years of hands-on experience in the semiconductor industry. Farhat is an expert in product, test, quality, reliability, and supply chain areas covering various hi-speed communication ICs, MEMS-based and CE System-based product lines. In 2016, Farhat led Quantenna to its IPO, which paved the way for the company’s acquisition by Onsemi for a staggering $1.1 billion in 2019.
As the General Manager/Vice President of Manufacturing at Onsemi, he successfully managed the 300mm EFK Fab as well as a revenue line exceeding $2 billion. Farhat is a recognized industry leader and uses his extensive experience to drive innovation in the field of semiconductor manufacturing. He began his career after graduating with a Master of Science in Electrical Engineering from the University of Arkansas.
Farhat Jahamgir
Founder, President and CEO
GSME
Secure-IC
Hassan Triqui
Co-Founder, CEO & President
Secure-IC
Hassan Triqui is Co-Founder, CEO and President of Secure-IC, rising leader and the only global provider of end-to-end cybersecurity solutions for embedded systems and connected objects. Hassan has over 25 years of experience in the technology sector. Prior to spearheading Secure-IC’s development into a major player in embedded cybersecurity solutions, he was a former senior executive at Thales and Technicolor Thomson.
Hassan holds a Master of Science in Electrical Engineering from the Institut National des Sciences Appliquées (INSA), as well as a Master of Business Administration from Rennes School of Business.
Hassan is a pioneer, a Brittany Tech patriot, and passionate about providing solutions that generate the real trust that clients deserve.
Hassan Triqui
Co-Founder, CEO & President
Secure-IC
Integrated Insights
Christopher Thomas
Chairman and Founder
Integrated Insights
Chris Thomas is the founder of Integrated Insights, an advisory firm serving the Boards, Chairpersons and CEOs of global companies; a Visiting Professor at Tsinghua University; a non-resident Senior Fellow in Artificial Intelligence and Emerging Technologies at the Brookings Institution; and a member of the Council on Foreign Relations.
Chris spent ten years as a Partner at McKinsey & Company, leading various efforts including the Asia Semiconductor Practice, the Global Digital Strategy Practice, and the Global IOT service line. Prior to McKinsey, Chris spent a decade at Intel. He was the General Manager of Intel China, the largest semiconductor business in China. Chris also held multiple executive roles at Intel’s global headquarters. These roles included Chief of Staff to Intel’s Chief Sales, Marketing, and Strategy Officer, where he advised on all key decisions for Intel’s 5,000-person global salesforce.
Chris began his career as a private equity investor at The Blackstone Group in New York City and has served as a Board Director at Velodyne, the inventor of LiDAR. Chris is recognized as a leading global authority on the global semiconductor industry and the impact of US and Chinese technology policies. In 2021, the State Council of the People’s Republic of China recognized Chris as a national-level foreign expert in science and technology. He received an MBA from Stanford Business School, where he was an Arjay Miller Scholar; a Master of Arts in Political Science from Stanford University; and a Bachelor of Science in Economics, summa cum laude, from the Wharton School.
Christopher Thomas
Chairman and Founder
Integrated Insights
Bosch Sensortec GmbH, Bosch Semiconductors China
Hongyu Wang
Regional President APAC, Vice President
Bosch Sensortec GmbH, Bosch Semiconductors China
Mr. Hongyu Wang is the President of Bosch Sensortec Asia Pacific and, as of August 2024, the Vice President of Bosch Semiconductors China. With nearly 18 years of experience in the sensor and semiconductor industry, he joined Bosch in 2006 and has since held various roles across multiple divisions and regions.
Mr. Wang began his career at Bosch Corporate Research in Stuttgart, focusing on hardware and algorithm development for sensor-related digital signal processing. In 2009, he moved to Bosch Automotive Electronics (Suzhou) as the Manager of Electronic System Development, and in 2010, joined Bosch Sensortec (Shanghai) as an ASIC Project Manager and Department Head. He later transitioned to BSH Home Appliances (Nanjing) in 2018, overseeing electronic systems and software development, and was appointed Head of the Global Electronics and Motor Division (Greater China) in late 2019.
He holds a Bachelor’s degree in Electrical Engineering from Zhejiang University and a Master’s degree in Electrical Information Technology from the University of Stuttgart.
Hongyu Wang
Regional President APAC, Vice President
Bosch Sensortec GmbH, Bosch Semiconductors China
Ventana Micro Systems
Marc Canel
Vice President of Business Development
Ventana Micro Systems
Marc Canel has extensive experience in the processor industry, driving ecosystems and business development for more than 30 years. He is Vice President of Business Development at Ventana Micro Systems, driving the integration of Ventana’s world class RISC-V products across markets. Prior to Ventana, he was at Imagination Technologies where he was Vice President of Business Development promoting graphics and compute products. Prior to Imagination, he was at Arm where he was Vice President of Security Technologies, driving the rollout of security across the Arm ecosystem. Prior to Arm, he was a Vice President of Product Management at Qualcomm, driving the rollout of content protection and privacy management technologies. He also worked on the software ecosystem of Qualcomm, supporting the OEMs customers looking for complete solutions. Prior to Qualcomm, he was at IBM where he had various technical and product management roles in the development of data networking products.
Marc Canel
Vice President of Business Development
Ventana Micro Systems
VIP Dinner Sponsor
Under the its unique “Silicon Platform as a Service” (SiPaaS) business model, VeriSilicon is committed to providing customers with platform-based, all-around, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. For more information, please visit: www.verisilicon.com.
VIP Reception Sponsor
Founded in 2009,Giantec specializes in the design of memory, analog, and mixed-signal integrated circuits. Its extensive product portfolio includes memories (EEPROM & NOR Flash), VCM Driver ICs, and Smart Card ICs, serving diverse industries such as automotive electronics, smartphones, DIMM, industrial control, LCD panels, and white goods. For more information, please visit: www.giantec-semi.com.
Platinum Sponsor
Established in 1987, TSMC is the world’s first dedicated semiconductor foundry. Today, TSMC serves 532 customers and manufactures 12,698 products covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics.
Co-organizer
Shanghai, China
60 HUANGPU ROAD, HONGKOU DISTRICT, SHANGHAI 200080
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