The GSA European Executive Forum, GSA’s premier event in Europe, will unfold over two exciting days, bringing together over 250 senior executives, influential speakers, and esteemed exhibitors from around the globe. This prestigious gathering will further solidify its reputation as the ultimate executive event for the semiconductor industry in the EMEA region.
Attendees will also have the opportunity to partake in an exclusive VIP Dinner at BMW World’s renowned “Bavarie” restaurant. This distinguished setting will allow guests, speakers, and attendees to unwind and engage in high-level networking, fostering valuable connections.
With its rich agenda and exceptional atmosphere, this event promises to be an unforgettable experience, paving the way for collaborations that will shape the future of the semiconductor industry.
This event will dive into topics including:
The Role Of Semiconductors In The AI Revolution, AI Trends and Innovations in Semiconductor Design and Manufacturing, The Rise of Edge AI in Automotive, Europe’s Shifting Outlook, Massive and Critical IoT, and more!
Infineon Technologies
Jochen Hanebeck
CEO
Infineon Technologies
Jochen Hanebeck has been a member of the Management Board of Infineon Technologies AG since 2016. He has been CEO since 2022 (appointed until 31 March 2027).
Jochen Hanebeck was born in 1968 in Dortmund. He received a degree in electrical engineering from RWTH Aachen University.
He has been with Infineon since 1994 (Siemens AG until 1999).
Jochen Hanebeck
CEO
Infineon Technologies
At ST, we are creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. As an integrated device manufacturer, we work with our customers and partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things.
We are edging closer to a world where connected devices will anticipate our needs and automate to meet them. Advances in artificial intelligence are driving this transformation, turning manual devices into autonomous robots—a trend already taking shape today. To ensure these robots operate efficiently and responsibly, an architectural shift will be necessary, and critical factors must not be overlooked. Join NXP CTO Lars Reger as he explores the world ahead and the technology framework for a future full of possibilities. Sponsored by: In this keynote, Stephanie Dismore, SVP and GM at AMD, will explore how AI is changing the way semiconductor professionals work and innovate, and touch on what’s driving future demand for AI. She will also address the critical role of open ecosystems in driving rapid AI adoption and fostering increased innovation across the industry. The automotive industry is undergoing a profound transformation, driven by a convergence of technological, economic, and consumer trends. This presentation explores the fundamental forces behind this shift and draws parallels with other industries that have successfully navigated similar disruptions. It examines the implications of this evolution for traditional Original Equipment Manufacturers (OEMs) and their ecosystem of partners. Special focus is placed on the strategic approaches adopted by Tesla and emerging Chinese OEMs, highlighting how their business models diverge from conventional practices. The challenges faced by legacy automakers in adapting to these new paradigms are analyzed, particularly in relation to structural inertia and the complexity of change management. Finally, the presentation outlines why this disruption represents a significant opportunity for the semiconductor industry, positioning it as a critical enabler of the next generation of automotive innovation. Sponsored by: Sponsored by: In this presentation, we will discuss the evolving structure of the semiconductor industry in light of the AI buildout, global technology competition, and the advent of new technologies. We will share the results of a recent survey collaboration between the GSA and Integrated Insights, in which nearly 150 global semiconductor executives discuss their investment priorities, regional footprint, responses to geopolitics, and views of the future industry structure. Non-Terrestrial Networks (NTN) are moving from concept to deployment — enabling global connectivity for IoT devices across land, sea, and space through standardized, cost-efficient infrastructure. Simply put, NTN is NB-IoT in space. But making that a reality requires tackling complex challenges while maintaining low cost and high scalability. At the same time, the presentation calls for European alignment. Europe has the engineering talent, semiconductor leadership, and emerging space ecosystem to take a global lead in NTN. It requires collaboration across the value chain. Cellular connectivity, with its global coverage, robust security, and scalability, is essential for IoT deployments. Standards such as LTE-M, NB-IoT, and Cat 1bis have been pivotal in meeting specific IoT requirements. As AI continues to enhance IoT applications, the transition to 5G becomes crucial for ensuring device longevity and improved connectivity. This transition, while presenting challenges, also offers significant opportunities for the semiconductor industry. ChatGPT was the game changer in the public perception of “What AI can do“. However, this has been connected to the usage of cloud compute, to expensive and super power hungry compute coming with all well known problems like “Who will pay for the service?“, “What about privacy?“, “What if I don’t have a data connection?“. Now the first generation of devices is being launched, that overcome this chasm – GenAI in edge devices like cars will be all around us, opening a new space of applications. Sponsored by:
DAY 1 TUESDAY, MAY 6
Registration and Networking
Welcome Remarks
Opening Remarks
Industry Outlook
Fireside Chat
Keynote – Rise of Responsible Robots
New Opportunities and Challenges
Networking Break
The Role of Semiconductors in the AI Revolution
Keynote – A Driving Force of Innovation
Panel – The Role of Semiconductors in the AI Revolution
Keynote – Transformation Challenges in Automotive
Networking Break
The Role of Semiconductors in the AI Revolution
Session Introduction
Panel – AI Trends and Innovations in Semiconductor Design and Manufacturing
Closing Remarks
VIP Reception @ Sofitel
Transportation to VIP Dinner
VIP Dinner
DAY 2 WEDNESDAY, MAY 7
Networking Breakfast
Welcome Back
Semiconductor Market Status & Outlook
Keynote – Competition, Commoditization, Capital and the Race to $1 Trillion: A Perspective
AI as the Main Growth Driver. Will Industrial and Automotive Recover?
Panel Discussion
Massive and Critical IoT
Keynote – A Vision for Satellite and NTN
In this keynote, Nordic Semiconductor CEO Vegard Wollan will outline NTN’s core technology aspects, what is needed to support massive and critical IoT use cases, and how edge AI can meaningfully contribute to this evolution.
Europe has a unique opportunity to build an independent, world-leading NTN ecosystem — at a time when global tensions demand it most.
Keynote – Cellular IoT Connectivity: Navigating the Leap from 4G to 5G – Challenges and Opportunities
Networking Break
Massive and Critical IoT
Keynote – The Intelligent IoT Imperative: Securing Critical Infrastructure in a Fractured World
The Rise of Edge AI in Automotive
Keynote – Highly Efficient GenAI in Automotive: The Revolution is Happening Now!
McKinsey/GSA Study – The Rise of Edge AI in Automotive
Panel Discussion
Networking Lunch
Innovate & Connect Workshop
Infineon Technologies
Andreas Urschitz
Chief Marketing Officer and Member of the Management Board
Infineon Technologies
Andreas Urschitz has been a member of the Management Board and Chief Marketing Officer of Infineon Technologies AG since 2022 (appointed until 31 May 2030).
Andreas Urschitz was born in 1972 in Klagenfurt, Austria. He obtained his master’s degree in commercial science at the Vienna University of Economics and Business. He has been with Infineon (Siemens AG until 1999) since 1995.
Andreas Urschitz
Chief Marketing Officer and Member of the Management Board
Infineon Technologies
imec
Bart Placklé
Vice President, Automotive Technologies
imec
Bart started his career at Acunia, an imec spinoff, where he advanced to become the general manager of the hardware business unit. In 2004, Bart joined Intel, and as chief architect and later automotive CTO, he led the development of high-performance automotive solutions, driving Intel’s automotive segment to become a multibillion-dollar business. Bart received the Intel Achievement Award in 201,6 and in 2021, Bart was appointed as the CTO of AXG Mobility-as-a-Service at Intel. In 2023, Bart returned to imec, assuming the role of vice president of automotive technologies.
Bart Placklé holds a Master of Science degree and a postgraduate degree in telecommunications from the University of Hasselt (Belgium) and imec (Leuven, Belgium), respectively. He also obtained a postgraduate degree in executive business economics from KU Leuven (Belgium).
Bart Placklé
Vice President, Automotive Technologies
imec
Intel
Bob Brennan
Vice President & GM, Customer Solutions Engineering, Intel Foundry Services
Intel
Bob Brennan is Vice President of Customer Solutions Engineering for Intel Foundry Services at Intel Corporation. He is responsible for leading the delivery of end-to-end design solutions to help IFS customers use Intel’s portfolio of unique IPs and design technology in their product designs.
In his previous role, Bob served as Vice President of Emerging Memory & System at Micron, where he managed product, design, and engineering teams to accelerate the delivery of new designs on new technologies. Bob also served as Senior Vice President of Memory Solutions Lab at Samsung. Prior to these roles, Bob spent 22 years at Intel serving in various senior technical positions, including Server Architecture, Laptop Architecture, Mobile SoC Architecture, and CPU Core Design, Verification and Architecture.
Bob Brennan
Vice President & GM, Customer Solutions Engineering, Intel Foundry Services
Intel
BMW Group
Christoph Grote
Senior Vice President, Electronics and Software
BMW Group
Christoph has been with BMW Group in Munich since 1997, bridging innovation and delivery. Throughout his career, he has led developments in batteries, fuel cells, cockpit systems, and information technology. Since 2014, he has served as Senior Vice President since 2014, overseeing research, advanced technologies, and innovation across global offices. In 2022, became the Senior Vice President of Electronics and Software, focusing on digital connectivity, software platforms, and automotive technology stacks. Passionate about in-car digital experiences, Christoph continues to push technological boundaries to enhance BMW’s next-generation automotive electronics.
Christoph has a PhD in Physics from the University of Cambridge and he began his career at McKinsey before joining BMW AG.
Christoph Grote
Senior Vice President, Electronics and Software
BMW Group
Kudelski Group
Christophe Nicolas
Senior Vice President, GTM Core Security Solutions and Group Chief Information Officer
Kudelski Group
Christophe is the Senior Vice President of GTM Core Security Solutions and Group Chief Information Officer at Kudelski Group. He has been with the company since 1996, holding various leadership roles within Nagracard and Nagravision and as the Founder of Kudelski Security. As a member of the Management Board, he leads the GTM team for Nagravision’s Core Security Solutions, overseeing security IP products, security labs, and device lifecycle management solutions.
As Group CIO, he is responsible for shaping the company’s overall information strategy, driving cloud strategic partnerships, leading enterprise digital transformation initiatives, and ensuring corporate security. Additionally, he oversees the Corporate Real Estate portfolio strategy for the Group.
He holds both a BSc and a Master’s degree in Computer Science from the Swiss Federal Institute of Technology in Lausanne, as well as an MBA with honors from IMD, Lausanne. A dedicated professional in the field of technology and security, he is also a member of the IEEE Computer Group.
Christophe Nicolas
Senior Vice President, GTM Core Security Solutions and Group Chief Information Officer
Kudelski Group
Integrated Insights
Christopher Thomas
Chairman and Founder
Integrated Insights
Chris Thomas is the founder of Integrated Insights, advising Boards, Chairpersons, and CEOs of global companies. He is a Visiting Professor at Tsinghua University, a Senior Fellow at Brookings, and a member of the Council on Foreign Relations.
Previously, Chris was a Partner at McKinsey, leading global practices in semiconductors, digital strategy, and IoT. He also spent a decade at Intel, serving as GM of Intel China, where he grew revenues by over 50% and led a $5B+ P&L. He held multiple executive roles, contributing $20B+ in revenue.
Chris began his career at Blackstone and has served on the board of Velodyne. Recognized as a global semiconductor expert, he was named a national-level foreign expert by China’s State Council. He holds degrees from Stanford and Wharton.
Christopher Thomas
Chairman and Founder
Integrated Insights
Siemens Digital Industries Software
Geoffrey Lee
Vice President, Europe, Middle East, Africa
Siemens Digital Industries Software
Geoff Lee started his career at Mentor Graphics/Siemens in 1999, where he was part of the team that successfully launched the Calibre EDA solution into the semiconductor market. Between 2001 and 2019, Geoff held several senior account management roles across Europe before moving to lead the Strategic Accounts team in 2019, focused on the largest customers globally. In January 2024, he became the Vice President EMEA at Siemens EDA, responsible for leading the business across Europe, Middle East and Africa.
Geoff is passionate about technology, inspiring people, thought leadership and leading by example
Geoff holds a BEng Honour’s degree in Electronic & Electrical engineering from Robert Gordons University, a Diploma in Marketing from Henley Business School and an MBA from Henley/Reading University.
Geoffrey Lee
Vice President, Europe, Middle East, Africa
Siemens Digital Industries Software
Sequans Communications
Georges Karam
President & CEO
Sequans Communications
Georges has served as the chairman of the board and chief executive officer since the company was founded in 2003. Before founding Sequans, Dr. Karam was vice president of cable access at Juniper Networks, running the cable engineering and marketing departments and managing the cable sales launch in the Europe, Middle East and Africa region. He joined Juniper Networks when the company acquired Pacific Broadband Communications (PBC), where he was vice president of engineering and general manager for Europe. Dr. Karam has served in a variety of senior management positions at Alcatel, SAGEM and Philips.
He is a senior member of IEEE, has authored numerous technical and scientific papers and holds several patents in digital communications. Dr. Karam holds a PhD in signal processing and communication theory from Ecole Nationale Supérieure des Télécommunications, Paris.
Georges Karam
President & CEO
Sequans Communications
Accenture
Guido D'Hert
Managing Director, Global Semiconductors Industry Lead
Accenture
Guido is the Managing Director and global semiconductor lead at Accenture, bringing over 25 years of experience in guiding high-tech companies through strategy pivots and market disruptions. He focuses on enabling digital transformation via emerging technologies like big data, AI, and hyper-automation. His mission is to create value for clients, partners, and teams by delivering innovative solutions to complex challenges.
Before Accenture, Guido worked at McKinsey in the Netherlands and Silicon Valley, as well as NXP Semiconductors. Residing in Eindhoven, he enjoys family life with his wife and four children and is dedicated to developing a local “food forest,” a self-sufficient ecosystem of edible plants.
Guido D'Hert
Managing Director, Global Semiconductors Industry Lead
Accenture
SiMa.ai
Harald Kroeger
Board Member, Head of Sales, President Automotive
SiMa.ai
Harald Kroeger has been a member of the board, head of sales, and president of automotive for SiMa.ai since January 2023. He previously served on the boards of Tesla and Rivian.
Until December 2021, Mr. Kroeger was a member of the board of management at Bosch, where he was responsible for all automotive operations, excluding powertrain. Prior to that, he spent 21 years at Mercedes-Benz, where he held various positions, including head of purchasing for electrics and electronics, head of quality, and head of development for electrics and electronics in Mercedes-Benz cars.
Mr. Kroeger holds a Master of Science in Electrical Engineering from Stanford University, as well as a Diplom-Ingenieur in Control Engineering and a Bachelor’s degree in Economics from the University of Hannover.
Harald Kroeger
Board Member, Head of Sales, President Automotive
SiMa.ai
Silian Partners
Helmut Gassel
Partner & Co-founder
Silian Partners
Dr Helmut Gassel, Partner & Co-Founder, contributes 30 years of semiconductor industry experience. He served as a member of Infineon’s Management Board as Chief Marketing Officer from 2016 to 2022 with responsibilities encompassing marketing, sales, strategy, and M&A. In this capacity, he led the €9bn acquisition and integration of Cypress Semiconductor and contributed to transform Infineon into a global top 10 semiconductor company.
Prior to joining Infineon in 1995 as a semiconductor design engineer, he worked in semiconductor research at Fraunhofer Institute.
Helmut Gassel
Partner & Co-founder
Silian Partners
Samsung Semiconductor
Jens Kahrweg
Senior Vice President & CEO, EMEA
Samsung Semiconductor
Jens Kahrweg is the head of Samsung Semiconductor Europe, Device Solutions division, and oversees EMEA operations of the Memory, System LSI, Foundry, and Display business units. During his career at Samsung, Jens Kahrweg has played a pivotal role in the European subsidiary’s System LSI business success, the overall growth in the automotive segment, and the business development in AI.
As a semiconductor business expert, he has been critical in making Device Solutions Europe a key player in the European System LSI automotive business segment. Under his management and leadership, the European System LSI team won several automotive projects worth a combined $3B+ in revenues over lifetime. Jens Kahrweg’s knowledge and experience have been key to this success.
Jens Kahrweg
Senior Vice President & CEO, EMEA
Samsung Semiconductor
Stellantis
Joachim Kahmann
Senior Vice President, Purchasing E/E Modules
Stellantis
Joachim Kahmann is the Head of Purchasing for Electric and Electronics at Stellantis. He is globally responsible for sourcing electronic systems and related hardware components, semiconductors, manufacturing services and software IP. In this role he supports the E/E architecture development and the innovation in ADAS and Infotainment at Stellantis, while driving the company´s semiconductor strategy and the direct collaboration with semiconductor partners.
Joachim joined Stellantis in early 2022 after working in the semiconductor industry for more than 20 years. He began his career as a production engineer for automotive gasoline pumps. He holds a degree in production engineering and a PhD in engineering.
Joachim Kahmann
Senior Vice President, Purchasing E/E Modules
Stellantis
Valeo
Joachim Mathes
CTO, Valeo Brain Division
Valeo
Joachim Mathes started his career at SWF in Germany in 1989 after graduating in electronic engineering from BA Stuttgart. He contributed to the development of ultrasonic sensors and first generation ADAS systems and worked with customers all over the world. Following the acquisition by Valeo, he was nominated Project Management Director.
Subsequently, moving back into R&D, he strengthened Valeo’s technology portfolio through a number of partnerships and acquisitions and led the creation of development centres in several regions, including China.
Since 2019, he has taken the role of CTO for what is today the Valeo Brain Division. His focus is on positioning Valeo in the value chain for software-defined vehicles, strategic planning to manage product innovation and leveraging the power of industry collaborations.
Joachim Mathes
CTO, Valeo Brain Division
Valeo
Infineon Technologies
Jochen Hanebeck
CEO
Infineon Technologies
Jochen Hanebeck has been a member of the Management Board of Infineon Technologies AG since 2016. He has been CEO since 2022 (appointed until 31 March 2027).
Jochen Hanebeck was born in 1968 in Dortmund. He received a degree in electrical engineering from RWTH Aachen University.
He has been with Infineon since 1994 (Siemens AG until 1999).
Jochen Hanebeck
CEO
Infineon Technologies
GSA
Jodi Shelton
Co-founder & CEO
GSA
Jodi Shelton is the Co-founder and CEO of GSA. A pioneer within the technology space, Shelton was instrumental in the creation of the Alliance and has continuously addressed global issues in the industry as the voice of its members. Under her leadership, GSA has grown its membership to include companies throughout the supply chain representing 30 countries across the globe. In her role as president, Shelton oversees GSA daily operations, ensuring that the Alliance remains focused on achieving its defined mission and goal to foster a more effective ecosystem through collaboration, integration and innovation. She is the key liaison between GSA and the business community at high-level financial and industry conferences, providing insight on key topics pertaining to the global fabless supply chain.
Shelton earned her bachelor’s degree in political science from San Diego State University and her master’s degree in political science from the University of Houston.
Jodi Shelton
Co-founder & CEO
GSA
NXP Semiconductors
Lars Reger
CTO & Executive Vice President
NXP Semiconductors
Lars Reger is executive vice president and chief technology officer for NXP Semiconductors. As CTO, Lars is responsible for managing new business activities and R&D in the automotive, industry 4.0, internet of things (IoT), mobile, connectivity and infrastructure focus markets.
Before joining NXP as head of automotive strategy in 2008, Lars gained deep insight into the microelectronics industry with a focus on the automotive sector. His past roles include head of process and product engineering at Infineon, and head of business development and product management for the connectivity business unit at Continental. In 2012, Lars was appointed CTO of Automotive at NXP and in December 2018, he was appointed NXP’s CTO with responsibility for the overall technology portfolio.
Lars Reger
CTO & Executive Vice President
NXP Semiconductors
MGX
Ondrej Burkacky
Managing Director - Semiconductors
MGX
Ondrej is a Managing Director at MGX, one of the largest private equity investors in AI and advanced technologies based in Abu Dhabi and New York. He leads the semiconductor division, where he drives global investments across the entire semiconductor value chain while working to build a semiconductor ecosystem in the UAE.
Prior to joining MGX, he spent 18 years at McKinsey & Company, serving as a Senior Partner and leading the firm’s Global Semiconductor Practice. Ondrej holds a master’s degree in chemistry and a PhD in physical chemistry from the University of Munich (LMU).
Ondrej Burkacky
Managing Director - Semiconductors
MGX
Robert Bosch
Michael Schaffert
Senior Vice President, Engineering E/E Architecture
Robert Bosch
Michael Schaffert is the Senior Vice President at Bosch Semiconductor, overseeing System Engineering since 2022. He joined Bosch in 1998 as a hardware development engineer. He later moved to ETAS GmbH, where he became the Director of Product Management and Development. Upon his return to Bosch, he held leadership roles in vehicle electrical/electronic architecture, customer engineering in Japan, and hardware development for powertrain control. In 2020, he co-founded Bosch’s XC division, where he led Base Software and Middleware development.
Michael studied electrical engineering at the Technical University of Stuttgart.
Michael Schaffert
Senior Vice President, Engineering E/E Architecture
Robert Bosch
TSMC EMEA
Paul de Bot
President
TSMC EMEA
Mr. Paul de Bot is President of TSMC EMEA. Mr. Paul de Bot joined TSMC in 2015, and after roles in account management, was appointed General Manager EMEA in 2022 and President in 2024, responsible for the TSMC business in Europe and Israel. Mr. Paul de Bot started his career at Philips in the area of video technology, reaching the position of Chief Strategy Officer of the digital TV systems division of Philips. In 2003 he joined Philips Semiconductors (which later became NXP Semiconductors) as Vice President Strategy & Business Development for their consumer, automotive and identification businesses, respectively. Prior to joining TSMC, Mr. Paul de Bot had further executive roles in the software industry and in corporate finance.
Mr. Paul de Bot received his M.S. in EE and Engineering Doctorate in Telecommunications from Eindhoven University of Technology of The Netherlands, and his M.S. in Business Valuation from TIAS Business School of The Netherlands.
Paul de Bot
President
TSMC EMEA
Soitec
Pierre Barnabé
CEO
Soitec
Pierre Barnabé is a businessperson who has been at the helm of 5 different companies and currently occupies the position of Group Chief Executive Officer & Director at Soitec SA, Chairman for Elexo SAS and Chairman of Bull SAS. He is also on the board of Ipsos SA and Bull SA.
In his past career, he occupied the position of Co-CEO & Global Head-Manufacturing Industry at Atos SE and Chairman & Chief Executive Officer of Evidian SA (a subsidiary of Atos SE), General Manager for Société Française de Radiotéléphone SA and Vice President-Human Resources & Transformation at Alcatel-Lucent SAS.
He received an undergraduate degree from NEOMA Business School and an undergraduate degree from École supérieure d’électricité.
Pierre Barnabé
CEO
Soitec
Pragmatic Semiconductor
Richard Price
Co-Founder & CTO
Pragmatic Semiconductor
Richard has over 25 years of experience in the development and commercialization of a wide range of new technologies based on novel processes, materials, and flexible electronics.
He has a BSc and PhD in Chemistry from the University of Durham. He is an inventor or co-inventor on over 25 patent families. Richard is a non-executive director at the Henry Royce Institute, the UK’s National Institute for Advanced Materials Research.
Richard Price
Co-Founder & CTO
Pragmatic Semiconductor
Wolfspeeed
Robert Feurle
CEO
Wolfspeeed
Robert Feurle has been appointed CEO of Wolfspeed, effective May 1, 205. He has led organizations for over 20 years that develop advanced power semiconductor solutions for automotive and other high-voltage applications, including silicon and SiC.
Feurle previously served as Executive Vice President and General Manager of the Opto Semiconductors Business Unit at AMS Osram AG, where he managed more than 10,000 employees across sites and factories worldwide.
Prior to Ams Osram, he spearheaded new product introductions in IGBT and SiC technologies at Infineon, focusing on competitive differentiation and profitable growth.
A citizen of both the United States and Germany, Feurle will return to the United States, where he previously spent a decade in executive roles at Micron Technology.
Robert Feurle
CEO
Wolfspeeed
AMD
Stephanie Dismore
Senior Vice President & Managing Director, EMEA
AMD
Stephanie Dismore
Senior Vice President & Managing Director, EMEA
AMD
WSTS
Tobias Pröttel
CEO
WSTS
Tobias Pröttel is the Chief Executive Officer of World Semiconductor Trade Statistics (WSTS), an internationally recognized organization renowned for delivering critical market data and insights in the semiconductor industry. Under his leadership, WSTS provides accurate and timely statistics, aiding stakeholders in making informed decisions. Tobias has a proven track record in the semiconductor sector, demonstrating expertise in market analysis and strategic planning. His commitment to excellence ensures that WSTS remains a trusted source for semiconductor market information.
Tobias Pröttel
CEO
WSTS
Nordic Semiconductor
Vegard Wollan
CEO & President
Nordic Semiconductor
Vegard Wollan was appointed Chief Executive Officer of Nordic Semiconductor in January 2024. He started his career with Nordic VLSI, which later became Nordic Semiconductor. As one of the inventor teams behind the AVR microcontroller technology, Vegard, in 1996, joined Atmel as VP and General Manager of the Touch and MCU Business Unit. Atmel was acquired by Microchip Technology in 2016, and Vegard went on to establish MyWo. In 2021, MyWo was merged into TouchNetix, a global innovation leader in touch technologies, where Vegard was the CEO previous to joining Nordic Semiconductor.
Vegard is based in Trondheim and Oslo, Norway. He holds an M.S. degree from the Norwegian University of Science and Technology in Computer Science and Electrical Engineering, Trondheim.
Vegard Wollan
CEO & President
Nordic Semiconductor
At ST, we are creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. As an integrated device manufacturer, we work with our customers and partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things.
VIP Dinner Sponsor
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and advanced packaging technology leadership. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of industry-leading technology, a rich IP portfolio, a world-class design ecosystem, in-house acceleration services and an operationally resilient global manufacturing supply chain. As stewards of Moore’s Law, our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain, particularly for advanced products. For further information visit www.intel.com/foundry.
VIP Reception Sponsor
Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization and digitalization. As a global semiconductor leader in power systems and IoT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We make life easier, safer, and greener. Together with our customers and partners. For a better tomorrow.
Networking Lunch Sponsor
TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2023, TSMC served 528 customers and manufactured 11,895 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 16 million 12-inch equivalent wafers in 2023.
Networking Break Sponsor
Soitec, a leader in semiconductor materials, uses unique innovative material to support the semiconductor market. Its products enhance the mobile and digital revolutions, powering mobile, automotive, industrial & AI applications. With over 4,000 patents, Soitec focuses on disruptive innovation to offer high-performance, energy-efficient, and competitive products. Headquartered in Bernin, France, and founded 30 years ago in Grenoble, Soitec has facilities and offices in Europe, the U.S., and Asia. For more information, visit www.soitec.com.
Event App Sponsor
Siemens EDA is a leader in the Electronic Design Automation industry and is a pioneer and leader in offering customers industry proven AI-powered solutions. Siemens EDA offers the industry’s broadest portfolio of software and hardware that electronics engineers use to design, verify, and manufacture the integrated circuits (ICs), advanced IC packages, and printed-circuit-board systems at the heart of digitalization. For more information on Siemens EDA products and services, visit siemens.com/eda or follow us on Youtube, LinkedIn, X, and Facebook.
Lanyard Sponsor
ASE, Inc. is the leading global provider of semiconductor manufacturing services in packaging and test. With strong leadership in heterogeneous integration, manufacturing efficiencies, and sustainability approaches, packaging innovation is at the heart of what ASE does. Today, ASE’s advanced packaging, system-in-package, and chiplet solutions are accelerating growth momentum across AI, HPC, Data Center, Automotive, IoT, 5G, and more. To learn about our VIPack™ and powerSiP™ platforms, please visit aseglobal.com or follow us on LinkedIn and X: @aseglobal.
Platinum Sponsor
Accenture, a global leader in professional services, empowers organizations to build digital cores and optimize operations through technology and robust ecosystem partnerships. With approximately 799,000 employees across more than 120 countries, Accenture merges expertise in cloud, data and AI with deep industry knowledge to deliver tangible results in Strategy & Consulting, Technology and more. Accenture is committed to creating comprehensive value for clients, partners and communities worldwide. Visit us at www.accenture.com.
Platinum Sponsor
UMC is a leading global semiconductor foundry company that provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. UMC has total 12 fabs in production with combined capacity close to 850,000 wafers per month, all certified with IATF-16949 automotive quality standard.
Gold Sponsor
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC) including artificial intelligence (AI) and machine learning, and more.
Gold Sponsor
Pragmatic Semiconductor is pioneering flexible semiconductor technology, sustainably delivering edge and item-level intelligence at scale.
The FlexIC Foundry operates a unique and innovative process offering sustainable production and rapid innovation cycle times, coupled with a pathway to supply chain resilience.
Driven by optimised, purpose-led design, our FlexICs – ultra-thin, flexible chips – empower innovators with connect, sense and compute capabilities to bridge our digital and physical worlds.
Gold Sponsor
Samsung Semiconductor Europe is a part of the global network of Samsung Electronics Co., Ltd. for providing component solutions, featuring industry-leading technologies in the areas of memory, system LSI, foundry, LED and display in Europe, the Middle East and Africa.
Silver Sponsor
The Kudelski Group is a world leader in core digital security technologies and solutions for media, cybersecurity and IoT. Since 1951, we have delivered innovative technologies and services across IoT, pay TV, cybersecurity, and public access, and led major tech advancements over the 20th and 21st centuries—including the Emmy- and Oscar-winning NAGRA recorder used by and featured in major Hollywood studio productions, including the Netflix series, “Spycraft”. Security is at our core and all Kudelski solutions are secure by design.
Silver Sponsor
Synopsys delivers leading silicon to systems design solutions that maximize our customers’ R&D capability and productivity. Companies trust Synopsys to pioneer new technologies getting them to market faster without compromise.
Dinner tickets are available exclusively with conference tickets. If you’ve already registered for the conference and would like to add a dinner ticket, please contact us at events@gsaglobal.org.
VIP Dinner ticket not included.
VIP Dinner will take place in the evening of May 6 at the BMW World.
VIP Dinner ticket not included.
VIP Dinner ticket not included.
Bayerstraße 12
80335 Munich, 80335 Germany
Other hotels within walking distance: