Written by Paul Cuddyer | Director of Sales | Technetics | paul.cuddyer@technetics.com Abstract Technetics Group’s novel thin film coatings provide a fully dense, non-porous, etch Read More..
Executive Interview with Ravi Subramanian, SVP & GM of the IC Verification Solutions, Siemens EDA In this interview with Ravi Subramanian, he identifies the Read More..
Convergence of Edge Computing, Machine Vision and 5G-Connected Vehicles Manouchehr Rafie, Ph.D., VP of Advanced Technologies, AI Chips & Algorithms, Gyrfalcon Technology Today’s societies Read More..
Paper Submitted by Ted Miracco, CEO, Cylynt COVID-19 has created plenty of global havoc including anti-piracy challenges for professionals working from home. One underreported Read More..
Paper Submitted by Bipul Talukdar, Director of Applications Engineering in North America, SmartDV The future of chip design in a few short years Read More..
Paper Submitted by Ross Miller, Vice President of Strategic Marketing & Business Unit, SkyWater Technology and Mohamed Kassem, CTO & Co-Founder, Efabless Wow, Read More..
Paper Submitted by Marc Witteman, CEO, Riscure Abstract Hardware Fault Attacks can break software security by revealing secrets during program execution, or changing the Read More..
Paper Submitted by Dave Kelf, Vice President of Marketing and Chief Marketing Officer, Breker Verification Systems The advent of cloud computing has opened new Read More..
A Study on PUF Technology as Silicon "InbornID" Paper Submitted by Teddy Kyung Lee, CTO, ICTK Root of Trust in IoT Supply Chain The Read More..
