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Semiconductor Industry News via Business Wire Business Wire is the leading source for press releases, photos, multimedia and regulatory filings from companies and groups throughout the world. Click here to view the latest semiconductor news from Business Wire. Global Semiconductor Alliance Adds Four Members to its Asia-Pacific Leadership Council San Jose, Calif. (September 1, 2010) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, today announced the addition of four new members to the GSA Asia-Pacific Leadership Council, which serves as advisors to the GSA Board of Directors on regional issues. The new members added to the council include: -Dr. Youm Huh, chief executive officer, president and chairman of the board, Silicon Mitus, Inc. -Dr. Tetsuya Iizuka, chief executive officer and founder, THine Electronics, Inc. -Wayne Liang, founder and chairman, MStar Semiconductor, Inc. -Dr. Sung-Wook Park, executive vice president and chief technology officer, Hynix Semiconductor, Inc.
2010 Memory Report Cites Important Memory Perspectives San Jose, Calif. (July 14, 2010) GSA, the voice of the global semiconductor industry, hosted the GSA Memory Conference in Taipei on March 16, 2010. Global memory executives met to discuss challenges and opportunities in the mainstream and emerging memory markets as well as address future opportunities to integrate logic and memory. As a result, the 2010 GSA Memory Conference Report was commissioned to give an overall perspective of the conference and memory market. GSA Supports Europe Start-ups and Key Enabling Technologies San Jose, Calif. (July 13, 2010) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces it is launching an awareness campaign for Europe to encourage the EU Commission, regional governments, universities, research organizations, industry and private equity firms to collaboratively provide the investment and infrastructure support that is vital to the ability of small- to medium-sized enterprises to bring sustainable innovative semiconductor product concepts to market. Combined with GSA’s efforts to grow the engine of innovation by establishing a thriving ecosystem for emerging semiconductor companies in Europe, GSA also announces full support for the European effort to provide policy recommendations on Key Enabling Technologies (KETs). GSA Announces Infrastructure to Ease Third Party Licensing Process for Semiconductor Industry San Jose, Calif. (July 12, 2010) GSA, the voice of the global semiconductor industry, today announces its plans to help third-party IP buyers and sellers reduce costs and shorten the IP negotiation cycle with a new IP Licensing Best Practices survey and report. European Expert Panel Proposes New Analogue IC Design Methodology to Counter the Analogue Bottleneck San Jose, Calif. (June 30, 2010) GSA, the voice of the global semiconductor industry, recently hosted a panel of European analogue IC design experts at the GSA & IET International Semiconductor Forum in London on 19 May. The discussion led to a possible solution to the analogue IC design bottleneck. The Global Semiconductor Alliance together with the UK’s Institution of Engineering & Technology joined forces to highlight and discuss European trends in semiconductor development. This year’s program focused on leveraging and maximising European expertise in analogue/mixed-signal, wireless, low-power applications and quality/reliability to access emerging markets for silicon growth including smart cards, power electronics and home networking. Global Semiconductor Alliance and VLSI Research Announce Partnership San Jose, Calif. (June 28, 2010) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, and VLSIresearch (VLSI) today announced an alliance aimed at providing industry executives with timely and detailed market intelligence on the global semiconductor, foundry, and associated supplier markets. GSA Introduces 2010 Memory Conference Report San Jose, Calif. (June 21, 2010) GSA, the voice of the global semiconductor industry, today announced the launch of its new 2010 GSA Memory Conference Report. On March 16, 2010, GSA held the first-ever GSA Memory Conference in Taipei. This unique conference brought together industry leaders, representatives from distinguished companies, world famous speakers, and analysts from research institutes to discuss “Bridging Memory and Logic ICs for Better System Performance.” With this theme as the pillar for this report, the researchers summarize the speakers’ presentations, provide analysis and important market information, as well as draw reference to addressable technology comparisons and applications. Comments from consultants and industry experts are also included, therefore enriching the comprehensiveness of this report. Modeling Workshop Panel Brings Complexity Challenges to Forefront London, England (June 14, 2010) The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, held a panel discussion during the GSA & IET International Semiconductor Forum in London on May 18, 2010 titled, “Better Analog Modeling and Integration with iPDKs.” The panel focused on the status and future directions of compact/SPICE device modeling, Verilog-A standardization and better model optimization and integration with advanced iPDKs. The panel was organized by Paul Double, GSA Analog/Mixed-Signal Interest Group chair in Europe and Wladek Grabinski, MOS-AK/GSA Modeling Working Group manager. GSA Luncheon Addresses the Trends in Consumer Electronics and the Communication Convergence San Jose, Calif. (April 28, 2010) DirecTV, GlobalFoundries, AMD, Marvell and Open-Silicon Weigh In on Challenges and Opportunities The Global Semiconductor Alliance (GSA) announces its Silicon Series Luncheon focused on The Future of Consumer Electronics and the Communications Convergence addressing emerging applications in consumer electronics (CE). The luncheon takes place at the Barton Creek Resort on May 6 in Austin, Texas. GSA Silicon Series Luncheon Focuses on Next-Generation Networks San Jose, Calif. (April 28, 2010) The Global Semiconductor Alliance (GSA) announces its Silicon Series Luncheon focused on Next-Generation Networks: The Evolution of Mobile Connectivity offering views and perspectives on wireless, 3G to 4G and LTE applications. The event takes place on May 4 at the Santa Clara Convention Center. The GSA mission is to provide thought leadership and insight areas of growth for our member base and chip companies across the globe, in addition to providing a platform for global collaboration to address supply-chain challenges and inefficiencies. MOS-AK/GSA Modeling Working Group Holds Workshop in Rome San Jose, Calif. (April 26, 2010) The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, held its annual spring workshop on April 8-9 at the Sapienza Universitŕ di Roma – the largest academic institution in Europe. More than 70 international academic researchers and modeling engineers attended this year's event, which marked two decades of the MOS-AK/GSA Modeling Working Group enabling compact modeling R&D exchange. The event was organized by Marco Balucani, Fernanda Irrera and Paolo Nenzi of Sapienza Universitŕ di Roma’s electronic engineering department. The workshop’s technical co-sponsorship was provided by the IEEE Electron Devices Society (EDS) and the COMON FP7 Project, with direct sponsorship offered by Agilent Technologies, Micron Technology and the Micron Foundation. GSA to Host Third Israel Executive Forum San Jose, Calif. (April 20, 2010) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces the third annual Israel Executive Forum in conjunction with ChipEx2010. The Forum will take place on May 4, 2010 at the Hilton Tel Aviv. GSA and the IET Co-Host the Seventh Annual GSA & IET International Semiconductor Forum San Jose, Calif. (April 6, 2010) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, and the Institution of Engineering and Technology (IET), the largest professional engineering society in Europe, announce the seventh annual GSA & IET International Semiconductor Forum, to be held on May 18-19, 2010 at the Novotel St. Pancras in London, England. Global Semiconductor Alliance Announces Results of 2010 BOD Elections San Jose, Calif. (March 31, 2010) The Global Semiconductor Alliance (GSA) announces the results of its 2010 Board of Directors’ member election and one new board appointment. The GSA BOD defines the organization’s strategic vision and direction. GSA Board Announces Two New Additions San Jose, Calif. (January 26, 2010) The Global Semiconductor Alliance (GSA) today announces the additions of Loic Lietar, corporate vice president of STMicroelectronics, and Jason Wang, president of United Microelectronics Corporation (UMC-USA) to its board of directors. GSA’s board is comprised of 22 industry executives who are representative of the global regions in which GSA holds active memberships. GSA Announces Silicon Series Line-Up San Jose, Calif. (January 25, 2010) The Global Semiconductor Alliance (GSA) announces a series of four luncheons focused on emerging applications and markets in 2010. The first Silicon Series Luncheon takes place at the Santa Clara Convention Center on February 10 in Santa Clara, Calif. The event theme is “New Markets, New Economics” and will focus on emerging markets, applications and technologies that are at the forefront of advancement for the semi industry. The GSA mission is to provide thought leadership and insight into the areas of growth for our member base and chip companies across the globe, in addition to providing a platform for global collaboration to address supply-chain challenges and inefficiencies. Global Semiconductor Alliance Announces Its 2009 Award Recipients San Jose, Calif. (December 14, 2009) The Global Semiconductor Alliance (GSA) announces the recipients of its 2009 awards , which are presented each year to outstanding semiconductor companies across the globe that have demonstrated excellence through their success, vision and strategy in the industry. The 2009 awards were presented at the GSA Awards Dinner Celebration , held on Thursday, Dec. 10, 2009, in Santa Clara, Calif. San Jose, Calif. (November 10, 2009) GSA Affirms Role as the Most Influential Voice of the Global Semiconductor Industry 2009 GSA Award Nominees Announced San Jose, Calif. (November 3, 2009) The Global Semiconductor Alliance (GSA) announces the nominees for awards to be presented at the GSA Awards Dinner Celebration on Thursday, Dec. 10, 2009, at the Santa Clara Convention Center in Santa Clara, Calif. Dr. Aart de Geus to Receive GSA's Dr. Morris Chang Exemplary Leadership Award San Jose, Calif. (October 13, 2009) The Global Semiconductor Alliance (GSA) announces industry veteran Dr. Aart de Geus as the recipient of the Dr. Morris Chang Exemplary Leadership Award, to be presented at the GSA Awards Dinner Celebration on Thursday, Dec. 10, 2009, at the Santa Clara Convention Center in Santa Clara, Calif. Global Semiconductor Alliance Announces Semiconductor Leaders Forum Taiwan 2009 Taipei, Taiwan (October 13, 2009) The Global Semiconductor Alliance (GSA) announces the program for its sixth annual Semiconductor Leaders Forum Taiwan, which will be held on Wednesday, Nov. 11, 2009, at the Ambassador Hotel Hsinchu, Taiwan. The theme of this year’s event focuses on “Clustering Collaboration” and will include keynote addresses from Joep van Beurden, chief executive officer of CSR, as well as Lars Jensen, director, Strategy and Business Development, Nokia Corporation. April 1, 2010 Semiconductor Ecosystem Survey • Current State of the Semiconductor Economy: Q4 2009 Recap / 2010 Expectations • MS/RF PCM Sub-Working Group Meeting March 4, 2010 Wafer Pricing & Mask Cost Trends Article • Accepting Abstracts for June 2010 GSA Forum • Semiconductor Ecosystem Survey • MS/RF PCM Sub-Working Group Meeting • MS/RF PDK Sub-Working Group Meeting February 4, 2010 Silicon Series Luncheon • Semiconductor Ecosystem Survey • Q1 2010 Wafer & Back-End Pricing Report • Accepting Abstracts for June 2010 GSA Forum January 7, 2010 Save the Date for 2010 Awards Dinner Celebration • Join the GSA IP Interest Group at DesignCon 2010 • Current State of the Economic Downturn • Gain Free Access to GSA's Wafer Fabrication & Back-End Pricing Report • Q3 2009 Global Semiconductor Financial Tracker • MS/RF PCM Sub-Working Group Meeting • MS/RF PDK Sub-Working Group Meeting December 3, 2009 3D Integration Initiatives • IC Foundry Almanac, 2010 Edition • Offshoring & Pricing Measurement in the Semiconductor Industry • Publish an Article in GSA Forum • MS/RF PCM Sub-Working Group Meeting November 5, 2009 IC Foundry Almanac, 2010 Edition • 3D Integration Initiatives • Free Access to Q4 2009 Wafer Fabrication & Back-End Pricing Reports • 2010 GSA Forum Editorial Calendar • MS/RF PCM/Process Checklist Sub-Working Group Meeting October 1, 2009 GSA Expo - IC Foundry Almanac 2010 Edition - M&A Strategies Report - Current Economin Monitor - Global Semiconductor Financials - Awards Dinner Celebration September 10, 2009 Complimentary Registration to Emerging Opportunities Expo & Conference • GSA Company Listing • New IP Reports • Receive Your Free Subscription to GSA Forum • Highlight Your Company in the Dec 2009 GSA Forum • August Global Semiconductor Funding, IPO & M&A Update • MS/RF PCM/Process Checklist • MOS-AK/GSA Workshop Wafer area shipments up 136% in Q1 May 14, 2010 While growth rates are moderate, current shipments are approaching pre-downturn levels, the SEMI Silicon Manufacturers Group reports. HTC asks ITC to stop iPad, iPhone, iPod sales in US May 13, 2010 Claiming patent infringement, Taiwan-based HTC has filed a complaint with the United States International Trade Commission aiming to halt the importation and sale of iPhones, iPads, and iPods in the United States. Innovation Award winners: a celebration of excellence May 13, 2010 For two decades, EDN’s annual Innovation Awards program has honored the most innovative technological advances as well as the designers behind those advances. This year was no different. Yet another new idea for FPGAs: relays? May 13, 2010 A relatively unnoticed paper at February's International Symposium on FPGAs described what may be the most radical technology of them all: FPGAs using electromechanical relays. Quad 8-bit digital potentiometer has internal EEPROM, consumes 5 μA May 13, 2010 Microchip Technology's new 8-bit, digital MCP4361 quad potentiometer and MCP4362 quad rheostat save their settings in internal EEPROMs. InP ICs halve jitter, double true analog bandwidth of real-time digital scopes May 13, 2010 Agilent Technologies has introduced the Infiniium 90000 X-Series of four-channel real-time oscilloscopes, which offer bandwidths as high as 32 GHz when you use two channels. VeriWave generator helps support Wi-Fi/radar coexistence May 13, 2010 VeriWave's new RFI (radio-frequency-interference) and DFS (dynamic-frequency-selection) pulse-generator system lets developers of 802.11n-compliant Wi-Fi chip sets, receivers, access points, and user devices expand test coverage. Lighting modules integrate LEDs, drivers, optics, and heat sinks May 13, 2010 Cree recently announced a line of lighting modules that combines the company's TrueWhite LEDs with driver electronics, optics, and primary-thermal-management components. Validating and characterizing switch-mode power supplies for maximum efficiency May 13, 2010 To ensure optimal efficiency with acceptable trade-offs, it’s important to validate and characterize SMPS designs by measuring switching and magnetic power loss to determine power-supply efficiency, as well as measuring power quality and harmonics to understand the effect of the SMPS on the power line. Digital-power management moves forward as licensing invites innovation May 13, 2010 Matt McKenzie, president of CUI, discusses the role of digital power. Overall power-supply efficiency depends on sweating the small stuff May 13, 2010 Sweating the small stuff adds up to significant system-level gains in efficiency—especially important in applications that rely on solar and battery power. A simple calibration for MEMS gyroscopes May 13, 2010 Silicon-based gyroscopes and their accelerometer siblings are increasingly prevalent in consumer-electronics equipment. However, inaccuracy in reported data may produce an end-user experience that’s worse than not having a MEMS-based system at all. Punching through the ether with RF-range extenders May 13, 2010 RF-front-end chips make it easier for you to design more distance into radios. May 13, 2010 A simple tool helps save the day when a robot’s steering wheel mysteriously begins to flicker and tremble. Circuit may save property and life May 13, 2010 Circuit sounds an alarm when a perimeter is breached. Supervise and power-sequence an SOC May 13, 2010 Use specialized reset chips to ensure deterministic start-up behavior. Bicolor LED driver uses two leads May 13, 2010 Wired-OR function with diodes steers and blocks current. Pulse generator with precision output-duty cycle operates at a repetition rate beyond 50 MHz May 13, 2010 A comparator with complementary outputs provides a 50% duty-cycle output that’s insensitive to power-supply-voltage changes. May 13, 2010 Stub-termination technology looks like a promising alternative to back-drilling, resolving many of its limitations. Can the United States continue to innovate? May 13, 2010 There’s no doubt that other countries are gaining in innovative capability, but is the United States slowing down when it comes to innovation? Design challenges for solar-powered HB-LED lighting May 13, 2010 Solar-powered HB-LED lighting systems combine a clean energy source with the advantage of an efficient form of lighting. Designing such systems requires understanding the major components of a solar-powered HB-LED lighting system, as well as the design challenges in implementing such a system. Foundry revenue gains to outperform semiconductor industry gains in 2010 May 12, 2010 Pent-up need for new consumer products will fuel foundry demand in 2010, with iSuppli expecting revenue to grow nearly 40%. NEDA, ECA merge, target counterfeit components May 11, 2010 “NEDA and ECA have been united with respect to their fight against counterfeit product and in support of the authorized channel," says Robin B Gray, Jr, NEDA executive vice president. Avnet’s Harley Feldberg: Monitoring and maintaining the recovery May 11, 2010 Harley Feldberg, president of Avnet EM (Electronics Marketing), talks about distributor Avnet Inc's recently closed fiscal Q3, the industry’s recovery, opportunities in Latin America and Japan, and growth from the analog market.
Technical Editor Paul Rako looks at analog technology in power supplies, interface, the signal path, and life in general. Mentor Graphics PCB design contest September 6, 2010 You have until Sept 24, 2010 to submit your PCB (printed circuit board) design to Mentor graphics for consideration in their annual design contest. Winners receive a TLA (technology leadership... Tektronix scope secret splash screens September 2, 2010 I came across a wild picture while searching Google images for my upcoming article on voltage references. The website that was serving the picture was about Easter eggs- the hidden content in DVDs... Darnell power forum in Chicago September 1, 2010 The Darnell Group has rebranded the Darnell Digital Power Forum as Darnell’s Power Forum. It is Sept 13-15, 2010 at Doubletree Hotel Chicago - Oak Brook. Cost of $947 gets you3-Day ... Radiometrix 9600 baud RF modem August 30, 2010 The fine folks at Radiometrix saw my article about RF range extenders and were nice enough to send a press release about a nifty 9600 Baud RF modem they make. This one is for the European 433MHz... Series-Connected Buck Boost Regulators August 30, 2010 NASA Tech Briefs had a great article about Series-Connected Buck Boost Regulators back in 2005. Good analog is good for decades, so I wanted to bring your attention to the article after my power... Digi-Key lets us sort by price August 30, 2010 The Minnesota-nice Erica Hanson just dropped me a note that advises that Digi-Key will now let you sort by price. You have to be a registered user, but most every engineer I know already is a... August 30, 2010 I told you how great the Fairchild power seminars were a couple of years ago. Well, lucky for us, Fairchild is putting on the seminars again this fall. Cost is $75 and you get the proceedings and... Electric vehicles, the reality sets in. August 24, 2010 Well, after pining for electricvehicles for a decade, the American people seem to be getting the fact that thereality of electric vehicles does not quite match the hype. The New York... August 19, 2010 Well sorta. My analog guru buddy Eric Schlaepfer likes to do all kinds of kookie timepiece projects. He is an apps engineer at Maxim Integrated Products. He makes clocks out of oscilloscope CRTs,... LTCC chip transformers from NASCENTechnology August 19, 2010 Analog guru and Maxim good-ol’ boy Eric Schlaepfer told me about this neat little company in South Dakota making LTCC (low-temperature co-fired ceramic) transformers. You can use them in... Texas Instruments online tech day June 29, 2010 August 19, 2010 I mentioned Texas Instruments’ tech days in a previous blog during the 2010 Embedded Systems Conference. Now TI is putting on a virtual tech day on their website. Analog and digital designers... Andy Turudic on Chinese crap and the demise of Western civilization August 19, 2010 Fellow Croatian madman and good ol’ boy Andy Turudic just snapped from one too many encounters with poor-quality merchandise. He writes:“We had a water leak at the house because a ground... International Rectifier launches on-line design tool August 19, 2010 The irrepressible Dona Dierberger from International Rectifier sent me an interesting press release about a new online web tool that will help you design point-of-load (POL) converters with their... Henry Ott in New Jersey, Eric Bogatin in Silicon Valley August 19, 2010 EMC and noise gurus Henry Ott and Eric Bogatin both have seminars this fall. Henry Ott will give an electromagnetic compatibility seminar (pdf) September 28 - 30, 2010 Ramada Inn, East Hanover,... NXP puts part search in an iPhone app August 19, 2010 NXP senior vice president Mike Noonen was nice enough to drop me a personal note about their new iPhone app that lets you search for NXP parts on your phone. This free application allows engineers... August 19, 2010 I recently came across a website that maintains that a PC gamer, using a mouse and keyboard, will beat a console gamer using an Xbox, PS3, or Wii. I was pretty astonished by this so I asked my... Southern Illinois U hosts botball robotics conference July 7, 2010 August 19, 2010 Southern Illinois University Edwardsville School of Engineering is hosting a conference on educational robotics July 7-11 2010, in Edwardsville Illinois (just outside St. Louis, MO). Here is... House power monitor deal at Fry’s August 19, 2010 Linear Technology analog guru, eFlea aficionado* and all around good ol’ boy Fran Hoffart sent me a note about a house power monitor that happen to be on sale at Fry’s Electronics, at least up... Microchip makes a smoke-detector ICs with alarm memory August 19, 2010 The vivacious Michelle Ragsdale from Microchip sent me a press release about their new RE46C162/3 (ion type) and RE46C165/6/7/8 (photo type) smoke detector ICs. The cool thing is that they used a... August 19, 2010 Jim Williams called me yesterday to tip me off that there is an antique radio swap meet at Foothill college tomorrow, Saturday August 7, 2010. Unlike the DeAnza eFlea next week, this one starts at... A dubious alternate engine idea August 19, 2010 My Nissan pal Bruce sent this revolutionary engine design. It is revolutionary with the speed it can toss away investor money. Like me, Bruce went to GMI, and he had to take the Carnot cycle in... Semtech and Microchip remote-control reference design August 19, 2010 The indomitable David Rodewald dropped me note that Semtec and Microchip have joined forces to design and offer a remote control reference design. The system allows for code-hopping encryption, so... National Semi introduces a new industrial video serializer August 19, 2010 I just got a press release from the hard-working Mark Alden over at National Semiconductor. The release describes a new SerDes (serializer-deserializer) that you can use to pipe video data,... Prototype breadboard and USB instruments rolled into one. August 19, 2010 CWAV has combined a prototype plug-in breadboard with their USB-based test equipment and tossed in a handful of parts to give you a prototyping station. This would be great for learning...
WIN SEMICONDUCTORS AND PRESTO ENGINEERING ANNOUNCE A STRATEGIC COLLABORATION
FOR GaAs TESTING SERVICES
Taipei, Taiwan and San Jose, CA (September 1, 2010) Presto’s Hubs in Silicon Valley and Europe to support characterization and production testing of WIN's GaAs MMIC and RF Devices austriamicrosystems announces a low-power, 2.4 GHz multi-channel FSK transceiver with built-in star network manager Unterpremstaetten, Austria (September 1, 2010) austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high performance analog ICs, has announced the AS3940, the first fully integrated 2.4 GHz multi-channel FSK (frequency shift keying) transceiver with integrated link manager for reliable control of star networks (up to 8 clients). It features low power, high sensitivity (-100 dBm @ 250kbps, -92 dBm @ 2 Mbps), data rates from 250 kbps up to 2 Mbps, and integrates a digital RSSI (received signal strength indictor), real-time-clock (RTC) and programmable clock output, a Gaussian filter, PLL (phase locked loop) and loop filter. Dolphin Integration’s Panoply of Memories and Standard Cell Libraries for easing the fabrication capacity shortage! Grenoble, France (August 27, 2010) The release of the SESAME Reduced Cell Stem Library uHD-BTF rel 1.2 complements the already celebrated Dolphin Integration’s High Density and Low Power optimized Panoply of Silicon IPs. VSN Systemen Selects Octasic’s Vocallo MGW for Multimedia Application Portfolio Montreal, Quebec (August 24, 2010) Octasic Inc., a leading innovator of media processing and wireless solutions, today announced that its Vocallo MGW multi-core DSP platform has been chosen by VSN Systemen, a leading telecom hardware and software developer, to power the media processing unit (MPU) of its newly launched OpenTSP NG portfolio. Octasic’s low power high performance processing technology gives systems integrators and solutions providers a robust platform for today’s most performance-demanding applications. austriamicrosystems announces new 144-channel dot matrix LED driver with industry’s highest efficiency and smallest size Unterpremstaetten, Austria (August 23, 2010) austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high performance analog ICs, has announced the AS1119, the most advanced and smallest LED dot-matrix driver (channels vs. PCB space) available. The AS1119 drives 144 LEDs but requires only 9 mm˛ PCB space, reduces external component count, reduces connector pin count and requires fewer PCB layers. Benefits for end users include up to 80% longer battery lifetime, more colorful effects and smoother running animations. The AS1119 is targeted for dot matrix displays in mobile phones, personal electronics and toys. Sidense Granted Anti-fuse Memory Cell Patent by USPTO Ottawa, Canada (August 20, 2010) Sidense announced that the United States Patent and Trademark Office (USPTO) has recently granted the Company Patent Number 7,755,162, “Anti-fuse Memory Cell.” DOLPHIN Integration unique actor for Application Engineering of Silicon IP Grenoble, France (August 20, 2010) The complexity of Systems-on-Chip tends to obscure their crucial connections to physical peripherals around it. The leader of Silicon IP for High Resolution converters is facing the difficulties of system peripherals for Audio and Measurement, with a new breed of Application Engineers. They address the all-too-often ignored expenses of performance losses due to connections and their Bill-of-Material increases. MIPS Technologies Joins with Hong Kong Science & Technology Parks Corporation to Foster IC Design Innovation Sunnyvale, California (August 17, 2010) MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, today announced it is teaming with Hong Kong Science and Technology Parks Corporation (HKSTPC) to ease SoC design for startups in Asia Pacific. Through the agreement, high-performance MIPS32® processor cores-including the MIPS32 4Kc®, M4K®, 4KEc® and 24KEcTM cores in a range of processes-will be available to HKSTPC clients as part of the organization's Multi Project Wafer (MPW) and Pilot Production programs. austriamicrosystems announces Class G and Class H Stereo Headphone Amplifiers with industry’s lowest power consumption Unterpremstaetten, Austria (August 16, 2010) austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high performance analog ICs, has announced the AS3560 and AS3561 Stereo Headphone Amplifiers for mobile phones, portable navigation devices, music / media players and any media device that uses headphones. These new 30 mW headphone amplifiers continuously adjust the supply rails in response to the input signal, thus drastically minimizing power consumption as compared to traditional Class AB amplifiers. Low power FSK transceiver from austriamicrosystems features simplest star network management Unterprenstaetten, Austria (August 10, 2010) austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs, today introduced the AS3900 27 MHz FSK (frequency shift keying) low power transceiver. The AS3900 features built-in star network management protocol, and is the only such transceiver operating in the 27 MHz worldwide ISM (industrial, scientific and medical) band. Operation in this band avoids the interference found in the popular but cluttered 2.4 GHz band and results in a lower amount of energy being absorbed by the human body (SAR or specific absorption rate). This is a key consideration for transmitters operated close to the human body such as a BAN (body area network) or MBAN (medical body area network). SIDENSE CORP. FILES MOTION FOR DISMISSAL AND/OR AMENDMENT OF KILOPASS’S CLAIMS Ottawa, Canada (August 10, 2010) Sidense announced it has filed a motion in US District Court seeking dismissal and/or amendment of Kilopass’s numerous claims on grounds that Kilopass has not satisfied the most basic legal requirements in its allegations against Sidense. Break-through in the embedded Memory market with Dolphin Integration’s dual port RAMs Meylan, France (August 6, 2010) Dolphin’s Dual Port memories are embedding the access strip design technique, with a pending patent, resulting in two major innovations: •The silicon area of Dolphin’s DpRAM is up to 50% denser than traditional DpRAM, •Dolphin’s DpRAM offers a new functionality to SoC designers: the full asynchronous access. austriamicrosystems announces a new highly flexible Lighting Management Unit for mobile applications Unterprenstaetten, Austria (August 3, 2010) austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs, has announced the AS3676, a highly Integrated Lighting Management Unit (LMU) with Ambient Light Sensing (ALS) and Dynamic Luminance Scaling (DLS). The chip integrates 13 current sinks, a high-efficiency step-up DC-DC converter and high-power charge-pump, an analog-to-digital converter (ADC) and a programmable low drop-out regulator (LDO), all incorporated with advanced algorithms for high-efficiency display and keypad backlight, funlight, smartlight and other advanced portable illumination and indication effects. Dolphin Integration announces the availability of a flexible CODEC configuration with ultra low power for providing Nomad systems Grenoble, France (July 30, 2010) Dolphin Integration launches its prevalent configuration for portable applications, enabling power saving thanks to the ultra low power architecture from Helium2. Benefiting from a 95 dB CODEC with its own embedded regulator and many features, the whole for a small area, is now possible. MIPS Technologies Delivers Reference Implementation for Skype on MIPS-Based™ Devices Sunnyvale, Calif. (July 26, 2010) MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, announced that support for the MIPS® architecture is included in new SkypeKitTM developer tools available now from Skype. Through the SkypeKit closed beta program, MIPS Technologies has developed a Skype reference implementation for the MIPS® architecture-the leading architecture for the digital home. NetLogic Microsystems Announces Breakthrough Multi-Core Processor Solution which Integrates 128 NXCPUs™ Santa Clara, Calif. (July 26, 2010) NetLogic Microsystems, Inc. [NASDAQ: NETL], a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, today announced the innovative XLP8128S multi-core communications processor solution that integrates 128 NXCPUs™ and over 160 programmable processing engines to deliver an unprecedented 160Gbps throughput and 240 million packets-per-second (Mpps) of intelligent application performance for next-generation 3G/4G mobile wireless infrastructure, enterprise, storage, security, metro Ethernet, edge and core infrastructure network applications. Dolphin Integration announces the availability of the HD-LP Panoply at 130 nm for reducing SoC area up to 20% Grenoble, France (July 23, 2010) The release of this High Density and Low Power optimized Panoply of Silicon IPs is a windfall for Designers to improve the area of their SoCs up to 20% for the whole of logic… austriamicrosystems celebrates 4th anniversary of high volume production of its best-in-class 120 V 0.35 µm High-Voltage CMOS process Austria, Unterpremstaetten (July 22, 2010) Successfully introduced already in May 2006, foundry customers benefit from a fully qualified, high-volume production proven and mature High-Voltage CMOS technology ideally suited for emerging applications such as sensor interfaces, power over ethernet, motor controllers and a variety of automotive applications Unterpremstaetten, Austria (July 22, 2010) – austriamicrosystems (SIX: AMS) Full Service Foundry business unit today announced the fourth anniversary of high volume production of its leading edge 120 V 0.35 µm High-Voltage CMOS technology H35. The H35 specialty foundry technology allows the integration of 3.3 V, 5 V, 20 V, 50 V and 120 V NMOS and PMOS devices on a single chip without any process changes. H35 is the first purely CMOS based High-Voltage foundry process that matches BCD performance and chip sizes at much lower process complexity. Rigorous modularity permits 100 % reuse of low voltage CMOS design IP. H35 offers fully scalable High-Voltage NMOS and PMOS devices, floating logic libraries as well as a best-in-class power-on resistance. This makes the 120 V High-Voltage CMOS technology a compelling solution for fabless design houses and IDMs engaged in fields such as sensor interfaces, power over ethernet, motor controllers and a variety of automotive applications. "The 0.35 µm High-Voltage CMOS process has been running for more than four years in high volume production in austriamicrosystems’ state-of-the-art 8-inch wafer fabrication facility. A vast number of foundry customers have benefited from austriamicrosystems’ high-voltage know-how and commitment to provide customers best-in-class analog semiconductor process technology, manufacturing and services.” says Thomas Riener, Vice President and General Manager of austriamicrosystems' Full Service Foundry business unit. “As only three mask levels on top of CMOS are required, it makes the H35 the lowest complexity process in the market. Combined with area and performance optimized devices, H35 is the optimum choice for designing competitive products in a voltage range from 20 V to 120 V.” For its fully automotive and medical qualified High-Voltage CMOS process H35, austriamicrosystems delivers its industry benchmark design environment (“HIT-Kit”). The HIT-Kit comes complete with silicon-validated digital libraries, I/O libraries meeting the military ESD and JEDEC latch-up standards with I/O pads designed to surpass 8 kV HBM and 250 mA latch-up immunity, special utilities optimized for High-Voltage CMOS product design and excellent characterized circuit simulation models. Read more details about this new HIT-Kit version on our Foundry Support Server at http://asic.austriamicrosystems.com/hitkit. About austriamicrosystems austriamicrosystems’ business unit Full Service Foundry has successfully positioned itself in the analog/mixed-signal foundry market offering well-established RF CMOS, High-Voltage CMOS, BiCMOS, SiGe-BiCMOS and embedded EEPROM processes. With superior support during the design phase, high-end tools and experienced engineers, austriamicrosystems succeeds to be an attractive analog foundry partner especially for fabless design houses. austriamicrosystems is a leading designer and manufacturer of standard and customized high-performance analog ICs in the areas of power management, sensors & sensor interfaces and mobile infotainment. Complemented by its full service foundry services, the company focuses on the communications, industrial & medical and automotive markets. austriamicrosystems leverages almost 30 years of expertise in low power and high accuracy to provide industry-leading products, operating worldwide with more that 1,000 employees with its own state-of-the-art manufacturing and test facilities. austriamicrosystems is listed on the SIX Swiss Exchange in Zurich (ticker symbol: AMS). For more information, visit www.austriamicrosystems.com. For further information Press Contact austriamicrosystems AG Ulrike Anderwald Marketing Communications Manager Tel: +43 (0) 3136 500 5856 Fax: +43 (0) 3136 500 5420 press@austriamicrosystems.com www.austriamicrosystems.com Technical Contact austriamicrosystems AG Andreas Wild Product Marketing Manager Full Service Foundry Tel: +43 (0) 3136 500 4400 Fax: +43 (0) 3136 500 5755 andreas.wild@austriamicrosystems.com www.austriamicrosystems.com DOLPHIN Integration and Infolytica Corporation enable mechatronic system simulation using MagNet and MotorSolve coupled with SMASH Montreal, Quebec and Grenoble, France (July 16, 2010) DOLPHIN Integration SA and Infolytica Corporation announce today that their solutions for mixed signal simulation and electromagnetic field simulation can now work together to perform powerful mechatronic system simulation. SMASH, from DOLPHIN Integration, can directly simulate response surface models of electric motors generated in VHDL-AMS by MagNet or MotorSolve, from Infolytica, and can perform a system level simulation of both the device and the control circuitry. Advantest Delivers Milestone 1000th T2000 SoC Test System Santa Clara, Calif. (July 13, 2010) Advantest Corporation (TSE: 6857, NYSE: ATE), the world’s foremost supplier of semiconductor test equipment, announced delivery of its milestone 1000th T2000 SoC test system to Xilinx, Inc. at its San Jose, CA facility. Dolphin Integration offers a cutting-edge solution for the smooth integration of a precise measurement Converter into a soC Meylan, France (July 9, 2010) Dolphin Integration extends their pursuit of reactivity for releasing fast and safe custom configurations for High Resolution Analog Front-Ends for Sensors. To this end, they had launched the configurator JAXSENS of a kit of pre-designed mixed-signal blocks. MIPS Technologies Teams with ETRI to Encourage SoC Design Innovation in Korea Sunnyvale, Calif. (July 8, 2010) MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, today announced that it is teaming with the Electronics and Telecommunications Research Institute (ETRI), Korea's leading research institute, to encourage SoC design innovation in Korea. Through the agreement, the ETRI IT SoC Industry Promotion Center has access to a range of high-performance MIPS32® processor cores that it can leverage in SoC design projects with startup incubator companies. NetLogic Microsystems Announces the Industry’s First 40Gbps Wire-Speed and Fully Deterministic Layers 2 - 7 Intelligent Processing Solution Santa Clara, Calif. (July 7, 2010) NetLogic Microsystems, Inc. [NASDAQ: NETL], a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, today announced the industry’s first fully deterministic intelligent networking solution capable of concurrently processing advanced Layers 2 - 7 functions at 40Gbps wire-speed. By using market-leading, best-in-class multi-core processing and knowledge-based processing technologies from NetLogic Microsystems, the new innovative NLX321103A solution enables the simultaneous and deterministic processing of complex networking functions such as deep packet content inspection, application-aware switching and routing, intrusion prevention (IPS), anti-virus/malware, network service management, packet ordering, parsing, IPv6/IPv4 forwarding, classification, IPSec/SSL encryption, ACL security, compression/decompression and quality-of-service (QoS) at 40Gbps wire-speed. austriamicrosystems and Dexter Magnetics Technologies, Inc. announce a value added distribution partnership Unterpremstaetten, Austria (July 6, 2010) Dexter Magnetic Technologies will be a franchised value-added provider of austriamicrosystems’ magnetic sensors and associated magnetic products, including engineered modules, in North America. This arrangement is focused on providing magnetic sensor customers with a complete engineered solution incorporating sensors and magnetic technology. Customers will have the ability to work with a single and dedicated source for all of their sensor and magnetic requirements. Dexter Magnetic Technologies has designed an assortment of precision magnetic components to complement austriamicrosystems’ magnetic sensors IC’s. “This partnership between our two companies is very unique for the design engineer as we are bridging the industry gap in magnetics knowledge and providing a single point of magnetic sensor design support for our customers,” commented Robert K. Brinley, Senior Vice President-Business Development. David Bates, austriamicrosystems’ Channel Partner Manager, Americas said, “Dexter Magnetic Technologies’ expertise in magnetic, electronic, and mechanical solutions brings new capabilities to our family of magnetic encoder IC’s, and extra value to our customers.” |
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